Fabrikantnummer

TE Connectivity Micro Stack Series Vertical Board Connector Assembly, 80 Contact(s), 0.6 mm Pitch, 2 Row, Shrouded

RS-stocknr.:: 677-531
Fabrikantnummer:: 6376611-1
Fabrikant:: TE Connectivity

TE Connectivity Micro Stack Series Vertical Board Connector Assembly, 80 Contact(s), 0.6 mm Pitch, 2 Row, Shrouded

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We weten niet of dit item nog op voorraad komt, RS is van plan dit binnenkort uit ons assortiment te halen.

RS-stocknr.:: 677-531
Fabrikantnummer:: 6376611-1
Fabrikant:: TE Connectivity

Specificaties

Datasheets

Wetgeving en compliance

Productomschrijving

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Alles selecteren	Attribuut	Waarde
	Merk	TE Connectivity
	Series	Micro Stack
	Product Type	Connector Assembly
	Current	500mA
	Pitch	0.6mm
	Housing Material	Liquid Crystal Polymer
	Number of Contacts	80
	Number of Rows	2
	Orientation	Vertical
	Shrouded/Unshrouded	Shrouded
	Connector System	Board-to-Board
	Mount Type	Board
	Contact Material	Copper Alloy
	Contact Plating	Gold
	Minimum Operating Temperature	-55°C
	Termination Type	Surface Mount
	Maximum Operating Temperature	85°C
	Contact Gender	Male
	Standards/Approvals	UL
	Voltage	10V

	Alles selecteren
	Merk TE Connectivity
	Series Micro Stack
	Product Type Connector Assembly
	Current 500mA
	Pitch 0.6mm
	Housing Material Liquid Crystal Polymer
	Number of Contacts 80
	Number of Rows 2
	Orientation Vertical
	Shrouded/Unshrouded Shrouded
	Connector System Board-to-Board
	Mount Type Board
	Contact Material Copper Alloy
	Contact Plating Gold
	Minimum Operating Temperature -55°C
	Termination Type Surface Mount
	Maximum Operating Temperature 85°C
	Contact Gender Male
	Standards/Approvals UL
	Voltage 10V

Datasheet - 6376611-1

Land van herkomst:: CN

The TE Connectivity PCB Mount Header is optimized for high-density board-to-board signal transmission in Compact electronic designs. With 80 positions and a fine 0.6 mm [.023 in] centerline spacing, it enables efficient routing while conserving valuable PCB real estate. Its partially shrouded vertical surface-mount configuration ensures precise mating and supports automated assembly.

80 Positions for dense signal interconnects

0.6 mm [.023 in] Centerline spacing for Compact layouts

Partially Shrouded Housing improves alignment and mechanical stability

Gold-Plated Contacts (Au) for superior conductivity and corrosion resistance

Surface-Mount Design supports streamlined board stacking and reflow soldering

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