Molex 76015 Series Vertical Through Hole Header, 56 Contact(s), 3.7 mm Pitch, 7 Row, Shrouded

Subtotaal (1 tray van 25 eenheden)*

€ 220,49

(excl. BTW)

€ 266,79

(incl. BTW)

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  • Klaar voor verzending vanaf 15 oktober 2026
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Tray(s)
Per tray
Per stuk*
1 +€ 220,49€ 8,82

*prijsindicatie

RS-stocknr.:
691-345
Fabrikantnummer:
76015-5402
Fabrikant:
Molex
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Merk

Molex

Series

76015

Product Type

Header

Pitch

3.7mm

Current

1A

Number of Contacts

56

Housing Material

High Temperature Thermoplastic

Number of Rows

7

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Through Hole

Contact Material

High Performance Alloy

Contact Plating

Gold

Row Pitch

3.7mm

Termination Type

Through Hole

Maximum Operating Temperature

85°C

Tail Pin Length

2.1mm

Standards/Approvals

UL E29179

Mating Pin Length

3.9mm

Voltage

120V

Land van herkomst:
MY
The Molex GbX I-Trac Vertical Header Module is designed for high-performance applications, meticulously engineered to enhance the reliability and efficiency of your backplane connectors. Featuring a Compact design with a pitch of 1.85mm by 3.70mm and accommodating 56 circuits, this module is Ideal for use in demanding environments. Its Durable construction supports a notable mating pin length of 3.90mm and employs a lead-free composition, ensuring compliance with contemporary environmental standards. The vertical orientation and open pin field layout provide flexibility in PCB design, making it the perfect choice for backplane and midplane applications while maintaining ease of use and assembly.

Supports a maximum current of 1.0A per contact for reliable power delivery

Delivers data rates up to 12.0 Gbps, ensuring robust performance for high-speed applications

Constructed with high temperature thermoplastic resin, offering excellent reliability in challenging environments

Utilises a unique 94V-0 flammability rating, ensuring safety and compliance for various applications

Compatible with through hole compliant pin styles, facilitating easy integration into diverse PCB designs

Designed for a durability of up to 200 mating cycles, prolonging product lifespan and effectiveness

Meets GADSL/IMDS regulations, ensuring responsible sourcing and environmental compliance

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