Molex 55917 Series Vertical Through Hole PCB Header, 12 Contact(s), 2 mm Pitch, 2 Row, Shrouded

Subtotaal (1 tray van 500 eenheden)*

€ 246,64

(excl. BTW)

€ 298,43

(incl. BTW)

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1 +€ 246,64€ 0,493

*prijsindicatie

RS-stocknr.:
691-927
Fabrikantnummer:
55917-1210
Fabrikant:
Molex
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Merk

Molex

Series

55917

Product Type

PCB Header

Pitch

2mm

Current

3A

Number of Contacts

12

Housing Material

Polyester

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Through Hole

Contact Material

Brass

Contact Plating

Tin

Row Pitch

2mm

Termination Type

Solder

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

105°C

Tail Pin Length

3.2mm

Standards/Approvals

UL E29179

Voltage

250Vrms

Land van herkomst:
VN
The Molex MicroClasp Wire-to-Board Header is designed for reliable electrical connections in a Compact form. This dual-row, vertical header accommodates up to 12 circuits, making it an Ideal choice for efficient signal transmission in various applications. Constructed with Durable polyester resin and featuring a tin-plated Interface for enhanced conductivity, it supports a maximum current of 3.0A and a voltage of up to 250V AC/DC. Its integration of a PCB locator ensures precise alignment during assembly, while a robust design maintains functionality across a wide temperature range of -40° to +105°C. The MicroClasp header meets industry compliance standards, reinforcing its role as a dependable component for modern electronic devices.

Supports up to 12 circuits for versatile connectivity needs

Designed for wire-to-board applications, ensuring secure signal transmission

Constructed from natural resin, providing robustness and longevity

Tin-plated mating surfaces enhance electrical conductivity for efficient performance

Operating temperature range ensures reliability in diverse environments

PCB locator feature facilitates accurate alignment during installation

Durability of up to 30 mating cycles allows for repeated use without compromise

Vertical orientation optimises space in tight electronic assemblies

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