Molex 4094 Series Right Angle Through Hole PCB Header, 4 Contact(s), 2.54 mm Pitch, 1 Row, Unshrouded
- RS-stocknr.:
- 786-411
- Fabrikantnummer:
- 22-12-2041
- Fabrikant:
- Molex
Momenteel niet beschikbaar
We weten niet of dit item nog op voorraad komt, RS is van plan dit binnenkort uit ons assortiment te halen.
- RS-stocknr.:
- 786-411
- Fabrikantnummer:
- 22-12-2041
- Fabrikant:
- Molex
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Molex | |
| Series | 4094 | |
| Product Type | PCB Header | |
| Pitch | 2.54mm | |
| Current | 4A | |
| Housing Material | Polyamide Nylon | |
| Number of Contacts | 4 | |
| Number of Rows | 1 | |
| Orientation | Right Angle | |
| Shrouded/Unshrouded | Unshrouded | |
| Connector System | Wire-to-Board | |
| Mount Type | Through Hole | |
| Contact Material | Brass | |
| Contact Plating | Gold | |
| Termination Type | Through Hole | |
| Tail Pin Length | 3.15mm | |
| Standards/Approvals | RoHS | |
| Voltage | 500V | |
| Alles selecteren | ||
|---|---|---|
Merk Molex | ||
Series 4094 | ||
Product Type PCB Header | ||
Pitch 2.54mm | ||
Current 4A | ||
Housing Material Polyamide Nylon | ||
Number of Contacts 4 | ||
Number of Rows 1 | ||
Orientation Right Angle | ||
Shrouded/Unshrouded Unshrouded | ||
Connector System Wire-to-Board | ||
Mount Type Through Hole | ||
Contact Material Brass | ||
Contact Plating Gold | ||
Termination Type Through Hole | ||
Tail Pin Length 3.15mm | ||
Standards/Approvals RoHS | ||
Voltage 500V | ||
- Land van herkomst:
- IN
The Molex Wire to board Header is designed for seamless electrical connections in various applications. This component plays a Crucial role in ensuring reliable performance within electronic assemblies.
Single-row design supports effective circuit connections
Right-angle configuration aids in space-efficient layouts
Constructed from PA polyamide nylon for robust durability
Gold plating enhances conductivity and reduces oxidation risk
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