Molex 3099 Series Vertical Through Hole PCB Header, 8 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded
- RS-stocknr.:
- 787-520
- Fabrikantnummer:
- 22-15-2086
- Fabrikant:
- Molex
Momenteel niet beschikbaar
We weten niet of dit item nog op voorraad komt, RS is van plan dit binnenkort uit ons assortiment te halen.
- RS-stocknr.:
- 787-520
- Fabrikantnummer:
- 22-15-2086
- Fabrikant:
- Molex
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Molex | |
| Series | 3099 | |
| Product Type | PCB Header | |
| Current | 2.5A | |
| Pitch | 2.54mm | |
| Housing Material | Nylon | |
| Number of Contacts | 8 | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Connector System | Wire-to-Board | |
| Contact Plating | Tin | |
| Contact Material | Brass | |
| Minimum Operating Temperature | -40°C | |
| Termination Type | Through Hole | |
| Maximum Operating Temperature | 105°C | |
| Contact Gender | Male | |
| Voltage | 500V | |
| Alles selecteren | ||
|---|---|---|
Merk Molex | ||
Series 3099 | ||
Product Type PCB Header | ||
Current 2.5A | ||
Pitch 2.54mm | ||
Housing Material Nylon | ||
Number of Contacts 8 | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Connector System Wire-to-Board | ||
Contact Plating Tin | ||
Contact Material Brass | ||
Minimum Operating Temperature -40°C | ||
Termination Type Through Hole | ||
Maximum Operating Temperature 105°C | ||
Contact Gender Male | ||
Voltage 500V | ||
- Land van herkomst:
- MY
The Molex Board Connector provides a High performance Interface for complex PCB assemblies and High density electronic systems. This precision-engineered component facilitates stable signal transmission while its specialized orientation allows for efficient vertical stacking or perpendicular board integration to maximise internal enclosure space.
Features robust construction for enhanced durability in harsh environments
Supports efficient wire-to-board connectivity, optimising space in designs
Compatible with a wide range of configurations to meet diverse application needs
Offers user-friendly engagement to simplify installation and maintenance
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