Molex 4455 Series Right Angle Through Hole PCB Header, 12 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded
- RS-stocknr.:
- 787-525
- Fabrikantnummer:
- 22-16-2120
- Fabrikant:
- Molex
Subtotaal (1 tray van 200 eenheden)*
€ 448,70
(excl. BTW)
€ 542,93
(incl. BTW)
GRATIS bezorging voor bestellingen van meer dan € 90,00
Nieuw product (vandaag reserveren)
- Verzending vanaf 13 oktober 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Tray(s) | Per tray | Per stuk* |
|---|---|---|
| 1 + | € 448,70 | € 2,244 |
*prijsindicatie
- RS-stocknr.:
- 787-525
- Fabrikantnummer:
- 22-16-2120
- Fabrikant:
- Molex
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Molex | |
| Product Type | PCB Header | |
| Series | 4455 | |
| Current | 2.5A | |
| Pitch | 2.54mm | |
| Number of Contacts | 12 | |
| Housing Material | Nylon | |
| Number of Rows | 1 | |
| Orientation | Right Angle | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Wire-to-Board | |
| Mount Type | Through Hole | |
| Contact Plating | Gold | |
| Contact Material | Bronze | |
| Termination Type | Through Hole | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 105°C | |
| Contact Gender | Male | |
| Voltage | 500V | |
| Alles selecteren | ||
|---|---|---|
Merk Molex | ||
Product Type PCB Header | ||
Series 4455 | ||
Current 2.5A | ||
Pitch 2.54mm | ||
Number of Contacts 12 | ||
Housing Material Nylon | ||
Number of Rows 1 | ||
Orientation Right Angle | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Wire-to-Board | ||
Mount Type Through Hole | ||
Contact Plating Gold | ||
Contact Material Bronze | ||
Termination Type Through Hole | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 105°C | ||
Contact Gender Male | ||
Voltage 500V | ||
- Land van herkomst:
- MY
The Molex Board Connector provides a High performance Interface for complex PCB assemblies and High density electronic systems. This precision-engineered component facilitates stable signal transmission while its specialized orientation allows for efficient vertical stacking or perpendicular board integration to maximise internal enclosure space.
Offers enhanced connectivity through its robust design
Facilitates easy installation with user-friendly features
Supports high-speed data transfer for modern electronic devices
Constructed to withstand rigorous industrial environments
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