Amphenol ICC 10075025 Series Straight Through Hole PCB Header, 20 Contact(s), 2 mm Pitch, 2 Row, Shrouded
- RS-stocknr.:
- 787-611
- Fabrikantnummer:
- 10075025-G01-20ULF
- Fabrikant:
- Amphenol ICC
Momenteel niet beschikbaar
We weten niet of dit artikel weer voorradig zal zijn, het wordt door de fabrikant stopgezet.
- RS-stocknr.:
- 787-611
- Fabrikantnummer:
- 10075025-G01-20ULF
- Fabrikant:
- Amphenol ICC
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Amphenol ICC | |
| Series | 10075025 | |
| Product Type | PCB Header | |
| Pitch | 2mm | |
| Number of Contacts | 20 | |
| Housing Material | Thermoplastic | |
| Number of Rows | 2 | |
| Orientation | Straight | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Wire-to-Board | |
| Mount Type | Through Hole | |
| Contact Plating | Gold | |
| Contact Material | Copper | |
| Termination Type | Through Hole | |
| Row Pitch | 2mm | |
| Contact Gender | Male | |
| Alles selecteren | ||
|---|---|---|
Merk Amphenol ICC | ||
Series 10075025 | ||
Product Type PCB Header | ||
Pitch 2mm | ||
Number of Contacts 20 | ||
Housing Material Thermoplastic | ||
Number of Rows 2 | ||
Orientation Straight | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Wire-to-Board | ||
Mount Type Through Hole | ||
Contact Plating Gold | ||
Contact Material Copper | ||
Termination Type Through Hole | ||
Row Pitch 2mm | ||
Contact Gender Male | ||
- Land van herkomst:
- FR
The Amphenol Header is designed to ensure reliable connections in demanding environments. Its robust construction and precise engineering provide exceptional performance for various applications while maintaining durability and integrity.
Constructed for longevity, ensuring reliable performance over time
Designed to withstand harsh environmental conditions without compromising functionality
Features precise engineering for consistent and efficient connectivity
Optimised for enhanced signal integrity across diverse applications
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