Molex 171974 Series Right Angle Through Hole PCB Header, 4 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded
- RS-stocknr.:
- 788-083
- Fabrikantnummer:
- 171974-0104
- Fabrikant:
- Molex
Momenteel niet beschikbaar
We weten niet of dit item nog op voorraad komt, RS is van plan dit binnenkort uit ons assortiment te halen.
- RS-stocknr.:
- 788-083
- Fabrikantnummer:
- 171974-0104
- Fabrikant:
- Molex
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Molex | |
| Product Type | PCB Header | |
| Series | 171974 | |
| Current | 3A | |
| Pitch | 2.54mm | |
| Number of Contacts | 4 | |
| Housing Material | Polymer | |
| Number of Rows | 1 | |
| Orientation | Right Angle | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Connector System | Wire-to-Board | |
| Contact Plating | Tin | |
| Contact Material | Brass | |
| Minimum Operating Temperature | -40°C | |
| Termination Type | Through Hole | |
| Maximum Operating Temperature | 105°C | |
| Contact Gender | Male | |
| Standards/Approvals | UL | |
| Voltage | 250V | |
| Alles selecteren | ||
|---|---|---|
Merk Molex | ||
Product Type PCB Header | ||
Series 171974 | ||
Current 3A | ||
Pitch 2.54mm | ||
Number of Contacts 4 | ||
Housing Material Polymer | ||
Number of Rows 1 | ||
Orientation Right Angle | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Connector System Wire-to-Board | ||
Contact Plating Tin | ||
Contact Material Brass | ||
Minimum Operating Temperature -40°C | ||
Termination Type Through Hole | ||
Maximum Operating Temperature 105°C | ||
Contact Gender Male | ||
Standards/Approvals UL | ||
Voltage 250V | ||
- Land van herkomst:
- MY
The Molex PCB header is designed to provide reliable and efficient electrical connections across various applications, optimising performance and durability in demanding environments.
Robust design ensures exceptional reliability in challenging conditions
Facilitates seamless integration with a wide range of existing systems
Offers versatility for various connectivity configurations
Enhances performance with high-speed data transmission capabilities
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