Molex 203564 Series Vertical Surface PCB Header, 40 Contact(s), 1 mm Pitch, 2 Row, Shrouded
- RS-stocknr.:
- 798-919
- Fabrikantnummer:
- 203564-4017
- Fabrikant:
- Molex
Afbeelding representeert productcategorie
Subtotaal (1 rol van 1100 eenheden)*
€ 4.566,00
(excl. BTW)
€ 5.524,86
(incl. BTW)
GRATIS bezorging voor bestellingen van meer dan € 90,00
Voorradig bij de fabrikant
- Klaar voor verzending vanaf 07 januari 2027
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Rol(len) | Per rol | Per stuk* |
|---|---|---|
| 1 + | € 4.566,00 | € 4,151 |
*prijsindicatie
- RS-stocknr.:
- 798-919
- Fabrikantnummer:
- 203564-4017
- Fabrikant:
- Molex
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Molex | |
| Series | 203564 | |
| Product Type | PCB Header | |
| Pitch | 1mm | |
| Number of Contacts | 40 | |
| Housing Material | Polyamide | |
| Number of Rows | 2 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Surface | |
| Connector System | Wire-to-Board | |
| Contact Plating | Gold | |
| Contact Material | Bronze | |
| Minimum Operating Temperature | -40°C | |
| Row Pitch | 1mm | |
| Termination Type | Surface Mount | |
| Maximum Operating Temperature | 105°C | |
| Voltage | 100V | |
| Alles selecteren | ||
|---|---|---|
Merk Molex | ||
Series 203564 | ||
Product Type PCB Header | ||
Pitch 1mm | ||
Number of Contacts 40 | ||
Housing Material Polyamide | ||
Number of Rows 2 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Surface | ||
Connector System Wire-to-Board | ||
Contact Plating Gold | ||
Contact Material Bronze | ||
Minimum Operating Temperature -40°C | ||
Row Pitch 1mm | ||
Termination Type Surface Mount | ||
Maximum Operating Temperature 105°C | ||
Voltage 100V | ||
- Land van herkomst:
- MY
The Molex PCB Header is designed for efficient connectivity in electronic applications, featuring a dual-row layout and a secure surface mount configuration.
1.00mm pitch design ensures Compact integration within electronic devices
Dual row configuration allows for higher circuit density
Surface mount style facilitates easy PCB assembly
0.38μm gold plating enhances conductivity and durability
Includes an inner positive lock mechanism for secure connections
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