Amphenol ICC 98464 Series Right Angle Through Hole PCB Header, 10 Contact(s), 2 mm Pitch, 2 Row, Shrouded
- RS-stocknr.:
- 799-064
- Fabrikantnummer:
- 98464-G61-10ULF
- Fabrikant:
- Amphenol ICC
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- RS-stocknr.:
- 799-064
- Fabrikantnummer:
- 98464-G61-10ULF
- Fabrikant:
- Amphenol ICC
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Amphenol ICC | |
| Series | 98464 | |
| Product Type | PCB Header | |
| Current | 2A | |
| Pitch | 2mm | |
| Number of Contacts | 10 | |
| Housing Material | Thermoplastic | |
| Number of Rows | 2 | |
| Orientation | Right Angle | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Connector System | Board-to-Board, Wire-to-Board | |
| Contact Plating | Gold or Tin over Nickel | |
| Contact Material | Phosphor Bronze | |
| Termination Type | Through Hole | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 125°C | |
| Contact Gender | Male | |
| Standards/Approvals | UL94V-0 | |
| Voltage | 650V | |
| Alles selecteren | ||
|---|---|---|
Merk Amphenol ICC | ||
Series 98464 | ||
Product Type PCB Header | ||
Current 2A | ||
Pitch 2mm | ||
Number of Contacts 10 | ||
Housing Material Thermoplastic | ||
Number of Rows 2 | ||
Orientation Right Angle | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Connector System Board-to-Board, Wire-to-Board | ||
Contact Plating Gold or Tin over Nickel | ||
Contact Material Phosphor Bronze | ||
Termination Type Through Hole | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 125°C | ||
Contact Gender Male | ||
Standards/Approvals UL94V-0 | ||
Voltage 650V | ||
- Land van herkomst:
- FR
The Amphenol ICC Minitek header is an Advanced connector is designed for Pin-in-Paste processes, ensuring reliable soldering for both board-to-board and wire-to-board applications while supporting high mechanical strength essential for various industrial settings.
Compatible with IR reflow soldering processes for efficient assembly
Insulation resistance rating of 1000ΩM minimum for enhanced reliability
Available in a variety of pin configurations, optimising compatibility with diverse applications
Moulded in high temperature thermoplastic, ensuring durability at elevated temperatures
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