Molex Micro-Fit Series Right Angle Through Hole PCB Header, 8 Contact(s), 3 mm Pitch, 2 Row, Shrouded
- RS-stocknr.:
- 205-1062
- Fabrikantnummer:
- 212528-0800
- Fabrikant:
- Molex
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- RS-stocknr.:
- 205-1062
- Fabrikantnummer:
- 212528-0800
- Fabrikant:
- Molex
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Molex | |
| Series | Micro-Fit | |
| Product Type | PCB Header | |
| Current | 12.5A | |
| Pitch | 3mm | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Contacts | 8 | |
| Number of Rows | 2 | |
| Orientation | Right Angle | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Connector System | Wire-to-Board | |
| Contact Plating | Tin | |
| Contact Material | Copper Alloy | |
| Termination Type | Solder | |
| Row Pitch | 3mm | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 85°C | |
| Contact Gender | Female | |
| Standards/Approvals | No | |
| Voltage | 600 V | |
| Alles selecteren | ||
|---|---|---|
Merk Molex | ||
Series Micro-Fit | ||
Product Type PCB Header | ||
Current 12.5A | ||
Pitch 3mm | ||
Housing Material Liquid Crystal Polymer | ||
Number of Contacts 8 | ||
Number of Rows 2 | ||
Orientation Right Angle | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Connector System Wire-to-Board | ||
Contact Plating Tin | ||
Contact Material Copper Alloy | ||
Termination Type Solder | ||
Row Pitch 3mm | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 85°C | ||
Contact Gender Female | ||
Standards/Approvals No | ||
Voltage 600 V | ||
- Land van herkomst:
- CN
The Molex Micro-Fit+ connector is a wire-to-board system which offers a 3.00mm pitch, a higher-current rating of 12.5A and superior design options for flexibility and efficient assembly. It is used in routers, appliances and charging stations.
Fully isolated contacts on each side of the interface
Prevents mis-mating; different than standard Micro-Fit 3.0
Enhanced TPA design
V-0/Glow Wire combination resin
Reflow options available
Reduced Mating Force by 40%
Smaller PCB footprint
Fully polarized housings
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