Molex 54363 Series Vertical Board PCB Socket, 70-Contact, 2 Row, 0.5 mm Pitch Surface Mount

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Subtotaal (1 rol van 2500 eenheden)*

€ 9.786,92

(excl. BTW)

€ 11.842,17

(incl. BTW)

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  • Verzending vanaf 25 februari 2026
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RS-stocknr.:
469-769
Artikelnummer Distrelec:
304-62-688
Fabrikantnummer:
54363-0778
Fabrikant:
Molex
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Merk

Molex

Number of Contacts

70

Product Type

PCB Socket

Sub Type

PCB Receptacle

Number of Rows

2

Pitch

0.5mm

Current

0.5A

Termination Type

Surface Mount

Housing Material

High Temperature Thermoplastic

Mount Type

Board

Orientation

Vertical

Stacking Height

2mm

Voltage

5 V

Series

54363

Minimum Operating Temperature

-25°C

Row Pitch

0.5mm

Maximum Operating Temperature

85°C

Contact Material

Phosphor Bronze

Contact Plating

Gold

Standards/Approvals

IPC 1752A Class C, EU RoHS, IEC 61249-2-21, IEC-62474, IPC 1752A Class D

Land van herkomst:
JP
The TE Connectivity 0.50mm Pitch Receptacle is designed to meet the demanding requirements of modern electronics. Boasting a dual-row configuration with a compact vertical design, this surface mount connector is engineered for optimal performance in board-to-board applications. With an impressive stacking height of 2.00mm, it offers versatility without compromising space on printed circuit boards. The component integrates seamlessly into diverse environments, having been crafted to comply with essential regulatory standards, including EU RoHS and REACH SVHC. Ideal for applications requiring reliable connections, this connector enhances signal integrity while ensuring durability through its robust construction. It supports up to 70 circuits, making it a remarkable choice for high-density interconnectivity solutions.

Designed for seamless integration in board-to-board applications

Complies with comprehensive environmental standards

Durable construction assures longevity and reliability

Supports efficient signal integrity across multiple circuits

Compact design optimises space without sacrificing performance

Versatile application across various electronic components

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