Molex PMC Mezzanine Series Straight Surface Mount Edge Connector, 64-Contact, 2-Row, 1mm Pitch, Solder Termination
- RS-stocknr.:
- 161-8007
- Fabrikantnummer:
- 71439-0164
- Fabrikant:
- Molex
Subtotaal (1 tube van 588 eenheden)*
€ 2.710,092
(excl. BTW)
€ 3.279,276
(incl. BTW)
GRATIS bezorging voor bestellingen van meer dan € 75,00
Tijdelijk niet op voorraad
- Verzending vanaf 21 april 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Aantal stuks | Per stuk | Per tube* |
|---|---|---|
| 588 + | € 4,609 | € 2.710,09 |
*prijsindicatie
- RS-stocknr.:
- 161-8007
- Fabrikantnummer:
- 71439-0164
- Fabrikant:
- Molex
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Molex | |
| Number of Contacts | 64 | |
| Number of Rows | 2 | |
| Pitch | 1mm | |
| Type | Board to Board | |
| Mounting Type | Surface Mount | |
| Body Orientation | Straight | |
| Termination Method | Solder | |
| Current Rating | 12A | |
| Voltage Rating | 100 V | |
| Series | PMC Mezzanine | |
| Contact Material | Bronze | |
| Series Number | 71439 | |
| Alles selecteren | ||
|---|---|---|
Merk Molex | ||
Number of Contacts 64 | ||
Number of Rows 2 | ||
Pitch 1mm | ||
Type Board to Board | ||
Mounting Type Surface Mount | ||
Body Orientation Straight | ||
Termination Method Solder | ||
Current Rating 12A | ||
Voltage Rating 100 V | ||
Series PMC Mezzanine | ||
Contact Material Bronze | ||
Series Number 71439 | ||
- Land van herkomst:
- CN
Vertical Stacking SMT Headers & Sockets 64 Way
A range of 1.00mm Pitch Mezzanine IEEE 1386 Receptacles, Surface Mount (SMT) in Dual Row for Vertical Stacking applications.
Allows PCI and S-bus (IEEE 1386) mezzanine cards to connect to VMEbus and Multibus host boards
Suitable for LAN, WAN, telecommunication, PC and workstation applications
Shrouded leaf design (minimises damaging header contacts)
Low insertion force sockets
High-temperature LCP housing for use with reflow solder processes
Antiflux design
Mated heights: 8 → 15mm (see combination guide)
Suitable for LAN, WAN, telecommunication, PC and workstation applications
Shrouded leaf design (minimises damaging header contacts)
Low insertion force sockets
High-temperature LCP housing for use with reflow solder processes
Antiflux design
Mated heights: 8 → 15mm (see combination guide)
Approvals
UL recognised component
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