TE Connectivity Z-PACK HM Series Straight Through Hole PCB Socket, 3-Contact, 2.54 mm Pitch Solder
- RS-stocknr.:
- 165-0967
- Artikelnummer Distrelec:
- 304-53-047
- Fabrikantnummer:
- 5-5223955-2
- Fabrikant:
- TE Connectivity
Subtotaal (1 tube van 60 eenheden)*
€ 233,52
(excl. BTW)
€ 282,54
(incl. BTW)
GRATIS bezorging voor bestellingen van meer dan € 90,00
Laatste voorraad RS
- Laatste 60 stuk(s), klaar voor verzending vanaf een andere locatie
Aantal stuks | Per stuk | Per tube* |
|---|---|---|
| 60 + | € 3,892 | € 233,52 |
*prijsindicatie
- RS-stocknr.:
- 165-0967
- Artikelnummer Distrelec:
- 304-53-047
- Fabrikantnummer:
- 5-5223955-2
- Fabrikant:
- TE Connectivity
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | TE Connectivity | |
| Product Type | PCB Socket | |
| Number of Contacts | 3 | |
| Sub Type | Board-to-Board | |
| Current | 1.15A | |
| Pitch | 2.54mm | |
| Housing Material | Liquid Crystal Polymer | |
| Termination Type | Solder | |
| Mount Type | Through Hole | |
| Orientation | Straight | |
| Connector System | Board-to-Board | |
| Voltage | 250V | |
| Series | Z-PACK HM | |
| Minimum Operating Temperature | -65°C | |
| Contact Plating | Gold | |
| Contact Material | Copper | |
| Contact Gender | Female | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | RoHS | |
| Alles selecteren | ||
|---|---|---|
Merk TE Connectivity | ||
Product Type PCB Socket | ||
Number of Contacts 3 | ||
Sub Type Board-to-Board | ||
Current 1.15A | ||
Pitch 2.54mm | ||
Housing Material Liquid Crystal Polymer | ||
Termination Type Solder | ||
Mount Type Through Hole | ||
Orientation Straight | ||
Connector System Board-to-Board | ||
Voltage 250V | ||
Series Z-PACK HM | ||
Minimum Operating Temperature -65°C | ||
Contact Plating Gold | ||
Contact Material Copper | ||
Contact Gender Female | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals RoHS | ||
- Land van herkomst:
- CN
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
The Z-PACK 2 mm HM Interconnection System is designed as a two part system for the connection of free boards (Daughterboards or PCBs) to fixed boards (Motherboards, Backplane or Backpanel) and feed the connection through the fixed board.
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