Amphenol Communications Solutions BergStak Series Straight Surface PCB Socket, 80-Contact, 2 Row, 0.8 mm Pitch Solder
- RS-stocknr.:
- 182-2974
- Fabrikantnummer:
- 61082-081402LF
- Fabrikant:
- Amphenol Communications Solutions
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- RS-stocknr.:
- 182-2974
- Fabrikantnummer:
- 61082-081402LF
- Fabrikant:
- Amphenol Communications Solutions
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
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Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Amphenol Communications Solutions | |
| Product Type | PCB Socket | |
| Number of Contacts | 80 | |
| Sub Type | Receptacle | |
| Number of Rows | 2 | |
| Pitch | 0.8mm | |
| Current | 800mA | |
| Housing Material | Glass Filled Liquid Crystal Polymer | |
| Termination Type | Solder | |
| Mount Type | Surface | |
| Orientation | Straight | |
| Connector System | Board-to-Board | |
| Stacking Height | 20mm | |
| Voltage | 100V | |
| Series | BergStak | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 125°C | |
| Contact Gender | Female | |
| Contact Plating | Gold | |
| Contact Material | Copper Alloy | |
| Standards/Approvals | No | |
| Alles selecteren | ||
|---|---|---|
Merk Amphenol Communications Solutions | ||
Product Type PCB Socket | ||
Number of Contacts 80 | ||
Sub Type Receptacle | ||
Number of Rows 2 | ||
Pitch 0.8mm | ||
Current 800mA | ||
Housing Material Glass Filled Liquid Crystal Polymer | ||
Termination Type Solder | ||
Mount Type Surface | ||
Orientation Straight | ||
Connector System Board-to-Board | ||
Stacking Height 20mm | ||
Voltage 100V | ||
Series BergStak | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 125°C | ||
Contact Gender Female | ||
Contact Plating Gold | ||
Contact Material Copper Alloy | ||
Standards/Approvals No | ||
Housing and terminal profile guarantees support of up to 12Gb/s
Vertical versus vertical mating configuration
40 to 200 position sizes in 20 position increments
5 mm to 20 mm stack heights in 1 mm increments
Housing and terminal profile guarantees support of up to 12Gb/s
Vertical versus vertical mating configuration
40 to 200 position sizes in 20 position increments
5 mm to 20 mm stack heights in 1 mm increments
0.8 mm double-row contact pitch conserves printed circuit board space
Scoop-proof feature housings
Multiple plating options available
Multiple packaging options available
PCB locator pegs option
Lead-free
Compatible with PCIe Gen 2/3 and SAS 3.0 high speed performance on selected stack heights
Suitable for parallel board stacking applications
Comprehensive range of sizes and stack heights to satisfy all needs
High density for all electrical applications needs
Prevents reverse mating
Satisfies different application requirement
Suitable for varies feeding processing
Facilitates ease and accuracy during manual assembly
BergStak® 0.80 mm Pitch, Receptacle, Vertical, Double Row, 80 Positions.
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