TE Connectivity Pluggable I/O Connector Receptacle Assembly Solder 1 Port 84-Position, 2149731-1

Subtotaal (1 tray van 2 eenheden)*

€ 258,20

(excl. BTW)

€ 312,42

(incl. BTW)

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  • Klaar voor verzending vanaf 09 juli 2026
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Tray(s)
Per tray
Per stuk*
1 +€ 258,20€ 129,10

*prijsindicatie

RS-stocknr.:
467-609
Artikelnummer Distrelec:
304-55-494
Fabrikantnummer:
2149731-1
Fabrikant:
TE Connectivity
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Merk

TE Connectivity

Termination Type

Solder

Sub Type

Receptacle Assembly

Product Type

Pluggable I/O Connector

Number of Ports

1

Current

0.5A

Number of Contacts

84

Contact Material

Copper

Contact Plating

Gold Flash over Nickel

Housing Material

Liquid Crystal Polymer

Series

CXP

Standards/Approvals

China RoHS 2 Directive MIIT Order No 32, EU ELV Directive 2000/53/EC, EU RoHS Directive 2011/65/EU, 2016, UL 94V-0

Land van herkomst:
CN
The TE Connectivity Receptacle assembly with cover is designed to ensure a robust connection, optimising performance in high-speed data applications. Its state-of-the-art construction utilises advanced materials that offer exceptional durability and reliability, making it suitable for a range of challenging environments. This assembly stands out with its innovative features that enhance electrical performance and mechanical stability, catering specifically to the evolving needs of modern connectivity solutions. Its compact design and superior engineering facilitate seamless integration into various electronic systems, ensuring that data transmission remains uninterrupted and efficient. Ideal for professional applications, this receptacle assembly not only adheres to industry standards but is also engineered with attention to sustainability, complying with European directives.

Engineered for optimal data rates up to 125 Gb/s

Constructed from liquid crystal polymer for enhanced thermal performance

Tin over nickel plating provides superior corrosion resistance

Designed to accommodate double-sided PCB mounting for versatile applications

Includes internal/external EMI springs for enhanced electromagnetic interference containment

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