Molex Pluggable I/O Connector QSFP I/O Connector Female Piercing 2 Port 152-Position, 204058-6101
- RS-stocknr.:
- 683-482
- Fabrikantnummer:
- 204058-6101
- Fabrikant:
- Molex
Subtotaal (1 tray van 3 eenheden)*
€ 217,78
(excl. BTW)
€ 263,51
(incl. BTW)
GRATIS bezorging voor bestellingen van meer dan € 90,00
Voorradig bij de fabrikant
- Klaar voor verzending vanaf 25 september 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Tray(s) | Per tray | Per stuk* |
|---|---|---|
| 1 + | € 217,78 | € 72,593 |
*prijsindicatie
- RS-stocknr.:
- 683-482
- Fabrikantnummer:
- 204058-6101
- Fabrikant:
- Molex
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Molex | |
| Form Factor | QSFP | |
| Product Type | Pluggable I/O Connector | |
| Sub Type | I/O Connector | |
| Termination Type | Piercing | |
| Current | 500mA | |
| Number of Ports | 2 | |
| Orientation | Right Angle | |
| Number of Contacts | 152 | |
| Contact Material | Copper Alloy | |
| Connector Gender | Female | |
| Contact Plating | Gold, Matte Tin | |
| Housing Material | Copper Alloy | |
| Series | 204058 | |
| Contact Gender | Female | |
| Standards/Approvals | IPC 1752A Class C & D, UL Certification: E29179, REACH, RoHS, IEC-62474, CHINA RoHS | |
| Alles selecteren | ||
|---|---|---|
Merk Molex | ||
Form Factor QSFP | ||
Product Type Pluggable I/O Connector | ||
Sub Type I/O Connector | ||
Termination Type Piercing | ||
Current 500mA | ||
Number of Ports 2 | ||
Orientation Right Angle | ||
Number of Contacts 152 | ||
Contact Material Copper Alloy | ||
Connector Gender Female | ||
Contact Plating Gold, Matte Tin | ||
Housing Material Copper Alloy | ||
Series 204058 | ||
Contact Gender Female | ||
Standards/Approvals IPC 1752A Class C & D, UL Certification: E29179, REACH, RoHS, IEC-62474, CHINA RoHS | ||
- Land van herkomst:
- CN
The Molex QSFP-DD Assembly is an innovative interconnect solution designed for high-density data applications. Featuring a stacked 2x1 design and a 4.50mm fin heat sink this assembly ensures optimal thermal performance and reliability. With a robust construction tailored for module to board applications this product supports substantial data throughput while adhering to stringent compliance standards such as EU RoHS and Halogen-Free. The assembly is specially designed for environments where thermal efficiency and durability are paramount making it an ideal choice for advanced network communications and data centre deployments.
Supports a maximum of 152 loaded circuits which ensuring high data capacity
Constructed from durable materials like high-temperature thermoplastic and copper alloy
Features a right-angle orientation for flexible installation options
Durability tested for up to 100 mating cycles guaranteeing long-lasting performance
Low-halogen content complying with environmental safety standards
Integration with various tooling for ease of installation and maintenance
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