Vishay 10 μF Surface Polymer Capacitor, 10V dc
- RS-stocknr.:
- 860-3837
- Fabrikantnummer:
- T55A106M010C0200
- Fabrikant:
- Vishay
Subtotaal (1 verpakking van 10 eenheden)*
€ 1,65
(excl. BTW)
€ 2,00
(incl. BTW)
GRATIS bezorging voor bestellingen van meer dan € 90,00
Laatste voorraad RS
- Laatste 230 stuk(s), klaar voor verzending vanaf een andere locatie
Aantal stuks | Per stuk | Per verpakking* |
|---|---|---|
| 10 + | € 0,165 | € 1,65 |
*prijsindicatie
- RS-stocknr.:
- 860-3837
- Fabrikantnummer:
- T55A106M010C0200
- Fabrikant:
- Vishay
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Vishay | |
| Product Type | Polymer Capacitor | |
| Technology | Polymer | |
| Capacitance | 10μF | |
| Voltage | 10V dc | |
| Mount Type | Surface | |
| Package/Case | 3216-18 | |
| Tolerance | ±20 % | |
| Maximum Operating Temperature | 105°C | |
| Dimensions | 3.2 x 1.6 x 1.6 mm | |
| Series | T55 | |
| Depth | 1.6mm | |
| Height | 1.6mm | |
| Length | 3.2mm | |
| Electrolyte Type | Solid | |
| Minimum Operating Temperature | -55°C | |
| Leakage Current | 10μA | |
| Alles selecteren | ||
|---|---|---|
Merk Vishay | ||
Product Type Polymer Capacitor | ||
Technology Polymer | ||
Capacitance 10μF | ||
Voltage 10V dc | ||
Mount Type Surface | ||
Package/Case 3216-18 | ||
Tolerance ±20 % | ||
Maximum Operating Temperature 105°C | ||
Dimensions 3.2 x 1.6 x 1.6 mm | ||
Series T55 | ||
Depth 1.6mm | ||
Height 1.6mm | ||
Length 3.2mm | ||
Electrolyte Type Solid | ||
Minimum Operating Temperature -55°C | ||
Leakage Current 10μA | ||
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets
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