3M Re-enterable Scotchcast Resin 8882 292ml Flexible Potting & Encapsulating Compound
- RS-stocknr.:
- 915-9735
- Fabrikantnummer:
- Re-enterable Scotchcast Resin 8882 292ml
- Fabrikant:
- 3M
Bulkkorting beschikbaar
Subtotaal (1 eenheid)*
€ 54,74
(excl. BTW)
€ 66,24
(incl. BTW)
GRATIS bezorging voor bestellingen van meer dan € 90,00
Op voorraad
- Plus verzending 11 stuk(s) vanaf 25 mei 2026
- Plus verzending 8 stuk(s) vanaf 08 juni 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Aantal stuks | Per stuk |
|---|---|
| 1 - 5 | € 54,74 |
| 6 - 11 | € 53,65 |
| 12 + | € 51,45 |
*prijsindicatie
- RS-stocknr.:
- 915-9735
- Fabrikantnummer:
- Re-enterable Scotchcast Resin 8882 292ml
- Fabrikant:
- 3M
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | 3M | |
| Product Type | Flexible Potting & Encapsulating Compound | |
| Trade Name | 3M 8882 High Gel | |
| Minimum Operating Temperature | -20°C | |
| Mixing Ratio | 1:1 | |
| Maximum Operating Temperature | 90°C | |
| Standards/Approvals | No | |
| Viscosity | Low | |
| Alles selecteren | ||
|---|---|---|
Merk 3M | ||
Product Type Flexible Potting & Encapsulating Compound | ||
Trade Name 3M 8882 High Gel | ||
Minimum Operating Temperature -20°C | ||
Mixing Ratio 1:1 | ||
Maximum Operating Temperature 90°C | ||
Standards/Approvals No | ||
Viscosity Low | ||
Vrijgesteld
3M Flexible Potting and Encapsulating Compound, 292ml Volume - Re-enterable Scotchcast Resin 8882 292ml
This flexible potting and encapsulating compound is engineered for superior performance in challenging environments. The 292ml encapsulating resin offers excellent adhesion and hydrolytic stability, making it ideal for protecting buried splices in the telecommunications and electrical industries. Its re-enterable design simplifies future inspections or repairs without the hassle of excessive cleaning.
Features & Benefits
• Advanced compound technology ensures no isocyanates are present
• High adhesion promotes strong moisture protection
• Easy re-entry allows for quick access to splices and repairs
• Compatible with forced-compound techniques for efficient application
• Low viscosity improves penetration at low temperatures
• Cost-effective solution compared to standard encapsulants
Applications
• Used to encapsulate buried cable splices
• Suitable for electrical infrastructure subject to harsh conditions
• Ideal for securing connections in automation and electronics
• Applied in environments requiring thermal and electrical insulation
• Used as a waterproof potting material in various installations
How does the encapsulating compound handle extreme temperatures?
The compound maintains its integrity and remains stable at both high and low temperatures, ensuring consistent performance under varying conditions.
Is the application of this compound straightforward?
Yes, it accepts various application techniques, including gravity-fill and forced-compound methods, making the process efficient and user-friendly.
What cleaning is required before applying this compound?
Minimal to no cleaning is necessary, allowing for quick application even when splicing filled cables.
Are there any health risks associated with using this product?
This compound is free from isocyanates, significantly reducing the risk of allergic reactions during use.
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- Potting Compounds
