BGA855N6E6327XTSA1 Infineon RF Amplifier Low Noise 17.8 dB, 6-Pin 1300MHz TSNP

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Verpakkingsopties
RS-stocknr.:
258-0668
Fabrikantnummer:
BGA855N6E6327XTSA1
Fabrikant:
Infineon
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Merk

Infineon

Operating Frequency

1300MHz

Product Type

RF Amplifier

Amplifier Type

Low Noise

Technology

Silicon Germanium

Mount Type

Surface

Gain

17.8dB

Minimum Supply Voltage

1.1V

Package Type

TSNP

Maximum Supply Voltage

3.3V

Pin Count

6

Third Order Intercept OIP3

0dBm

P1dB - Compression Point

60mW

Noise Figure

1.1dB

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

85°C

Standards/Approvals

JEDEC47/20/22

Series

BGA855N6

Automotive Standard

No

Infineon BGA855N6 Series RF Amplifier, 0.60dB Noise Figure, 17.8dB Gain - BGA855N6E6327XTSA1


This RF amplifier is a silicon-germanium low-noise amplifier designed for single-frequency RF stages operating at 1300MHz. It is a surface-mount device supplied in a TSNP package and intended for systems requiring low-voltage operation and Compact board integration. The device functions across a wide temperature range and conforms to JEDEC47 mechanical standards for reliability in assembly and handling.

Features and Benefits:


• 0.60dB noise figure for improved weak-signal reception
• 17.8dB gain to increase signal amplitude with low distortion
• 1.1 to 3.3V supply range for low-voltage system compatibility
• P1dB 60 mW output compression point to maintain linearity under drive
• OIP3 0 dBm for third-order intermodulation characterisation

Applications


• Suitable for single-frequency receiver front-ends
• Ideal for short-range RF communication modules
• Used with Compact surface-mount transceiver assemblies
• Can be used for low-power wireless test platforms
• Suitable for laboratory evaluation of SiGe amplifier stages

What supply voltages are required for operation?


It operates from a minimum of 1.1V up to a maximum of 3.3V.

What thermal conditions can it tolerate during use?


The device is rated from -40 to 85°C for operating environments.

What package and mounting method does it use?


It is supplied in a TSNP package intended for surface mounting.

How many electrical connections does the device provide?


The component has a pin count of 6 for PCB interfacing.

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