Weller Wire, 0.8mm Lead Free Solder, 217-221°C Melting Point

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€ 27,27

(excl. BTW)

€ 33,00

(incl. BTW)

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  • Verzending 25 stuk(s) vanaf 23 februari 2026
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RS-stocknr.:
244-1547
Artikelnummer Distrelec:
302-38-693
Fabrikantnummer:
T0051402599
Fabrikant:
Weller
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Merk

Weller

Wire Diameter

0.8mm

Model Number

WSW SAC M1

Percent Lead

0%

Product Form

Wire

Melting Point

217-221°C

Percent Silver

3%

Percent Tin

96.5%

Flux Type

M1

Product Weight

100g

Flux Content Percent

3.5%

Percent Copper

0.5%

Land van herkomst:
JP

Weller Lead Free Solder, 217 to 221°C Melting Point, M1 Flux - T0051402599


This lead-free solder is designed for optimal performance in both manual and robotic soldering applications. The high-quality Weller solder wire caters to professionals in the automation, electronics, and mechanical fields, ensuring durable solder joints.

Features & Benefits


• 0.8mm diameter compatible with a variety of soldering tasks
• Alloy composition of Sn96.5Ag3.0Cu0.5 for effective performance
• Features a 100% continuous M1 flux core to enhance efficiency
• Reduced tip consumption saves time and resources during use
• High melting point of 217 to 221°C supports robust soldering applications

Applications


• Utilised in precise electronic assembly
• Suitable for intricate robotic soldering processes
• Effective for soldering on oxidised or contaminated materials
• Ideal for creating durable, crack-resistant connections
• Employed in maintenance and repair tasks

How does this solder enhance soldering efficiency?


The continuous flux core reduces the need for frequent tip maintenance, which saves time.

Is this solder appropriate for high-temperature applications?


Yes, its elevated melting point allows it to endure high soldering temperatures.

Can this solder be applied in automated processes?


It is optimised for performance in both manual and robotic soldering settings.

What features are in place to maintain cleanliness during soldering?


The reduced splash design helps keep the work area tidy.

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