TE Connectivity, 36501, 0402 Surface Mount Inductor 8.2 nH 5 % 680 mA Idc Q:22

Subtotaal (1 rol van 2000 eenheden)*

€ 544,00

(excl. BTW)

€ 658,00

(incl. BTW)

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2000 +€ 0,272€ 544,00

*prijsindicatie

RS-stocknr.:
474-294
Artikelnummer Distrelec:
304-63-495
Fabrikantnummer:
3-1624112-1
Fabrikant:
TE Connectivity
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Merk

TE Connectivity

Product Type

Surface Mount Inductor

Inductance

8.2nH

Maximum DC Current

680mA

Package/Case

0402

Length

1.27mm

Packaging

Tape & Reel

Automotive Standard

No

Maximum DC Resistance

0.104Ω

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

125°C

Series

36501

Inductance Tolerance

5 %

Height

0.61mm

Standards/Approvals

EU RoHS 2011/65/EU, EU ELV 2000/53/EC, China RoHS 2 MIIT Order No 32, 2016

Maximum Self Resonant Frequency

4.4GHz

Minimum Quality Factor

22

Inductor Construction

Wirewound

Land van herkomst:
TW
The TE Connectivity high frequency inductor is meticulously designed for optimal performance in compact applications. Showcasing an impressive inductance value, this product excels in environments where precision and efficiency are paramount. The innovative wire-wound construction facilitates enhanced inductance stability while ensuring minimal DC resistance, making it ideal for surface mount technology (SMT) deployments. With its robust current rating, this inductor provides reliable, continuous operation in demanding conditions. The carefully engineered dimensions, coupled with a low-profile design, allow for seamless integration into various circuit layouts. This component is not just a passive device; it embodies the cutting-edge advancements of the Sigma 3650 series, making it an essential element for high-frequency applications.

Features a surface mount design for effortless PCB integration

Exhibits a low DC resistance for improved efficiency over time

Designed to operate within a broad temperature range for versatility

Offers a compact package size that saves valuable circuit board real estate

Incorporates taped and reeled packaging for streamlined assembly processes

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