TE Connectivity Holsworthy RN73 1.62 kΩ, 0603 Thin Film Surface Mount Resistor 0.1 % Surface 0.063 W - 2-1879133-7

Subtotaal (1 rol van 1000 eenheden)*

€ 447,00

(excl. BTW)

€ 541,00

(incl. BTW)

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  • Klaar voor verzending vanaf 08 oktober 2026
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RS-stocknr.:
478-574
Artikelnummer Distrelec:
304-59-361
Fabrikantnummer:
2-1879133-7
Fabrikant:
TE Connectivity
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Merk

TE Connectivity

Resistance

1.62kΩ

Product Type

Surface Mount Resistor

Technology

Thin Film

Resistor Type

Precision

Package/Case

0603

Packaging

Tape & Reel

Tolerance

0.1 %

Voltage

5V

Power Rating

0.063W

Mount Type

Surface

Temperature Coefficient

±10 ppm/°C

Automotive Standard

No

Series

Holsworthy RN73

Pin Count

2

Maximum Operating Temperature

260°C

Length

1.55mm

Height

0.45mm

Standards/Approvals

2016, China RoHS 2 MIIT Order No 32, EU ELV 2000/53/EC, EU RoHS 2011/65/EU

Width

0.8mm

Land van herkomst:
TW
The TE Connectivity Surface mount precision resistor redefines reliability with its thin film design. Engineered for high performance, it boasts a resistance value of 1.62K ohm, making it ideal for accurate and stable circuit applications. Its compact 0603 package size ensures easy integration into a variety of electronic devices, while a power rating of 0.063 W and a precise tolerance of 0.1% promise excellent operational stability under diverse conditions. The resistor’s low temperature coefficient of ±10 ppm/°C guarantees minimal drift over temperature fluctuations, ensuring long-term dependability. Committed to compliance, this component meets rigorous industry standards, making it the go-to choice for designers aiming for excellence in performance and safety while addressing even the most challenging electronic requirements.

Compact dimensions allow for effective use in space-constrained designs

Excellent thermal stability enhances overall circuit performance

Low moisture sensitivity ensures durability in humid environments

Low halogen content promotes environmental sustainability

Reflow solder capability simplifies assembly while maintaining integrity

Provides consistent results that bolster overall device reliability

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