RND RND 460 Series Thermal Gap Pad, 0.25mm Thick, 3W/m·K, Silicone, 100 x 103 x 5mm
- RS-stocknr.:
- 492-067
- Fabrikantnummer:
- RND 460-00114
- Fabrikant:
- RND
Subtotaal (1 verpakking van 10 eenheden)*
€ 8,88
(excl. BTW)
€ 10,74
(incl. BTW)
Informatie over voorraden is momenteel niet toegankelijk - Controleer het later nog eens opnieuw
Verpakking(en) | Per verpakking | Per stuk* |
|---|---|---|
| 1 + | € 8,88 | € 0,888 |
*prijsindicatie
- RS-stocknr.:
- 492-067
- Fabrikantnummer:
- RND 460-00114
- Fabrikant:
- RND
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | RND | |
| Dimensions | 100 x 103 x 5mm | |
| Thickness | 0.25mm | |
| Length | 100mm | |
| Width | 100mm | |
| Thermal Conductivity | 3W/m·K | |
| Material | Silicone | |
| Series | RND 460 | |
| Alles selecteren | ||
|---|---|---|
Merk RND | ||
Dimensions 100 x 103 x 5mm | ||
Thickness 0.25mm | ||
Length 100mm | ||
Width 100mm | ||
Thermal Conductivity 3W/m·K | ||
Material Silicone | ||
Series RND 460 | ||
- Land van herkomst:
- CN
The RND Thermal Gap Pad is designed to enhance heat transfer efficiency in demanding applications, providing a reliable solution for optimising thermal management. Comprising a silicone formulation, this pad is both environmentally friendly and inherently sticky, eliminating the need for adhesives that could compromise its performance. Its outstanding compressibility and flexibility allow it to conform to various surfaces, ensuring maximum contact and minimal thermal resistance. The pad operates effectively across a wide range of temperatures, from -50 to 200 degrees Celsius, making it suitable for various environmental conditions. With superior thermal conductivity and low thermal impedance, it is an essential component for applications requiring efficient heat dissipation.
Resistant to flames, providing added safety in high-temperature applications
Operates effectively at both high and low temperatures
Low thermal resistance at lower pressures optimises performance
Self-adhesive properties eliminate extra assembly materials
Operates effectively at both high and low temperatures
Low thermal resistance at lower pressures optimises performance
Self-adhesive properties eliminate extra assembly materials
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