Cypress Semiconductor CYUSB3304-68LTXI, USB Controller, 4-Channel, 68-Pin QFN
- RS-stocknr.:
- 182-0327P
- Fabrikantnummer:
- CYUSB3304-68LTXI
- Fabrikant:
- Cypress Semiconductor
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*prijsindicatie
- RS-stocknr.:
- 182-0327P
- Fabrikantnummer:
- CYUSB3304-68LTXI
- Fabrikant:
- Cypress Semiconductor
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Cypress Semiconductor | |
| Number of Transceivers | 4 | |
| Product Type | USB Controller | |
| Power Supply Type | Single | |
| ESD Protection | Yes | |
| Mount Type | Surface | |
| Package Type | QFN | |
| Pin Count | 68 | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 85°C | |
| Height | 0.95mm | |
| Length | 8mm | |
| Width | 8mm | |
| Alles selecteren | ||
|---|---|---|
Merk Cypress Semiconductor | ||
Number of Transceivers 4 | ||
Product Type USB Controller | ||
Power Supply Type Single | ||
ESD Protection Yes | ||
Mount Type Surface | ||
Package Type QFN | ||
Pin Count 68 | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 85°C | ||
Height 0.95mm | ||
Length 8mm | ||
Width 8mm | ||
Infineon USB Controller, 68 Pins, Surface Mount Type - CYUSB3304-68LTXI
This USB controller is a compact Infineon device designed to manage multiple USB transceivers within embedded systems. It operates from a single power rail and is intended for surface-mounted integration where board space and vertical profile are constrained. The component includes electrostatic discharge safeguarding and is specified for extended temperature environments common in mobile and automotive-adjacent electronics.
Features and Benefits:
• Four transceivers enabling multi-channel USB connectivity
• Single-supply operation simplifying power-rail design
• ESD protection reducing risk from electrostatic events
• Surface-mount QFN package for automated assembly
• Broad temperature range supporting harsh environments
• Low-profile package aiding slim system designs
• Single-supply operation simplifying power-rail design
• ESD protection reducing risk from electrostatic events
• Surface-mount QFN package for automated assembly
• Broad temperature range supporting harsh environments
• Low-profile package aiding slim system designs
Applications
• Suitable for multi-port USB hubs in compact devices
• Ideal for in-vehicle infotainment interface modules
• Used with industrial controllers requiring robust I/O
• Can be used for portable electronics with limited height
• Appropriate for automotive-adjacent sensor communication systems
• Ideal for in-vehicle infotainment interface modules
• Used with industrial controllers requiring robust I/O
• Can be used for portable electronics with limited height
• Appropriate for automotive-adjacent sensor communication systems
What pin count should I plan for on the PCB footprint?
The device uses a 68-pin layout, so the board footprint and routing must accommodate that pin count.
How does the package influence thermal management on the PCB?
The QFN format provides a short thermal path to the board
designers should include thermal vias and copper pours beneath the package to aid heat dissipation.
What assembly considerations are important for this component?
As a surface-mount QFN, it requires precise solder paste deposition and reflow profiles suitable for low-profile packages to ensure reliable joints.
Which environmental range can the device handle during operation?
It is rated to function from -40°C up to 85°C, covering a wide span of operating conditions.
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