Molex, 74060 2 mm Pitch Backplane Connector, Vertical, 25 Column, 8 Row, 200 Way
- RS-stocknr.:
- 691-156
- Fabrikantnummer:
- 74060-2504
- Fabrikant:
- Molex
Momenteel niet beschikbaar
We weten niet of dit item nog op voorraad komt, RS is van plan dit binnenkort uit ons assortiment te halen.
- RS-stocknr.:
- 691-156
- Fabrikantnummer:
- 74060-2504
- Fabrikant:
- Molex
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Molex | |
| Product Type | Backplane Connector | |
| Current | 3A | |
| Number of Contacts | 200 | |
| Number of Columns | 25 | |
| Orientation | Vertical | |
| Voltage | 120V | |
| Number of Rows | 8 | |
| Housing Material | High Temperature Thermoplastic | |
| Pitch | 2mm | |
| Contact Material | Beryllium Copper | |
| Mount Type | Through Hole | |
| Contact Plating | Gold | |
| Termination Type | Press Fit | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | RoHS Compliant | |
| Series | 74060 | |
| Alles selecteren | ||
|---|---|---|
Merk Molex | ||
Product Type Backplane Connector | ||
Current 3A | ||
Number of Contacts 200 | ||
Number of Columns 25 | ||
Orientation Vertical | ||
Voltage 120V | ||
Number of Rows 8 | ||
Housing Material High Temperature Thermoplastic | ||
Pitch 2mm | ||
Contact Material Beryllium Copper | ||
Mount Type Through Hole | ||
Contact Plating Gold | ||
Termination Type Press Fit | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals RoHS Compliant | ||
Series 74060 | ||
- Land van herkomst:
- CN
The Molex VHDM Single-Ended Board-to-Board Backplane Header is engineered for optimising space and performance in demanding applications. Designed with a Compact 2.00mm pitch and a vertical orientation, it accommodates 200 circuits across 8 rows with a pin length of 5.15mm, making it Ideal for high-density PCB layouts. The robust construction ensures reliable connections while maintaining compliance with industry standards such as EU RoHS and Low-Halogen regulations. Whether you're working on backplane applications or requiring a versatile interconnect solution, this product stands out for its durability and high performance in data transfer up to 3.125 Gbps, backed by a maximum current rating of 3A.
Supports a data rate of 3.125 Gbps for efficient signal transmission
Constructed from high-temperature thermoplastic for enhanced durability
Features a ground plane shield for reduced electromagnetic interference
Durability rating of 200 mating cycles enhances longevity and reliability
Easy integration with PCB designs due to its through-hole compliant pin style
Compliant with EU RoHS and industry standards for environmental safety
Supplied in tube packaging for enhanced protection during transport