Molex, 74060 2.00 mm Pitch PCB Connector, Vertical, 25 Column, 8 Row, 200 Way
- RS-stocknr.:
- 795-623
- Fabrikantnummer:
- 74060-2502
- Fabrikant:
- Molex
Subtotaal (1 tube van 2 eenheden)*
€ 309,46
(excl. BTW)
€ 374,45
(incl. BTW)
GRATIS bezorging voor bestellingen van meer dan € 90,00
Tijdelijk niet op voorraad
- Verzending vanaf 28 september 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Tube(s) | Per tube | Per stuk* |
|---|---|---|
| 1 + | € 309,46 | € 154,73 |
*prijsindicatie
- RS-stocknr.:
- 795-623
- Fabrikantnummer:
- 74060-2502
- Fabrikant:
- Molex
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Molex | |
| Product Type | Connector | |
| Backplane Connector Type | PCB | |
| Current | 3A | |
| Number of Contacts | 200 | |
| Number of Columns | 25 | |
| Orientation | Vertical | |
| Number of Rows | 8 | |
| Voltage | 120, 120V ac | |
| Housing Material | High Temperature Thermoplastic | |
| Pitch | 2.00mm | |
| Contact Material | Beryllium Copper | |
| Contact Plating | Gold | |
| Termination Type | Through Hole | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | UL | |
| Series | 74060 | |
| Alles selecteren | ||
|---|---|---|
Merk Molex | ||
Product Type Connector | ||
Backplane Connector Type PCB | ||
Current 3A | ||
Number of Contacts 200 | ||
Number of Columns 25 | ||
Orientation Vertical | ||
Number of Rows 8 | ||
Voltage 120, 120V ac | ||
Housing Material High Temperature Thermoplastic | ||
Pitch 2.00mm | ||
Contact Material Beryllium Copper | ||
Contact Plating Gold | ||
Termination Type Through Hole | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals UL | ||
Series 74060 | ||
- Land van herkomst:
- CN
The Molex Board-to-Board Backplane Header offers a robust and versatile interconnection solution. Featuring a 2.00mm pitch design, it accommodates 200 circuits across 8 rows, ensuring reliable performance for backplane applications.
Supports a maximum current of 3.0A per contact for efficient power handling
Contains 200 circuits providing high-density interconnection options
Rated for data rates up to 3.125 Gbps, ensuring fast signal transmission
Constructed with high-temperature thermoplastic for enhanced durability
Utilises a ground plane shield for improved electrical performance