Molex, 75117 2 mm Pitch Backplane Connector, Vertical, 10 Column, 8 Row, 80 Way

Subtotaal (1 tube van 10 eenheden)*

€ 988,44

(excl. BTW)

€ 1.196,01

(incl. BTW)

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  • Verzending vanaf 25 september 2026
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Aantal stuks
Per stuk
Per tube*
10 +€ 98,844€ 988,44

*prijsindicatie

RS-stocknr.:
691-168
Fabrikantnummer:
75117-0118
Fabrikant:
Molex
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Merk

Molex

Product Type

Backplane Connector

Current

3A

Number of Contacts

80

Number of Columns

10

Orientation

Vertical

Voltage

120V

Number of Rows

8

Housing Material

High Temperature Thermoplastic

Pitch

2mm

Contact Material

Copper Nickel Silicon

Mount Type

Through Hole

Contact Plating

Gold

Minimum Operating Temperature

-55°C

Termination Type

Press Fit

Maximum Operating Temperature

105°C

Standards/Approvals

RoHS Compliant

Series

75117

Land van herkomst:
CN
The Molex VHDM Single-Ended Board-to-Board Stacker Receptacle is engineered for high-performance applications that require robust connectivity. Designed with an 18mm stack height and a 2.00mm pitch, this receptacle accommodates up to 80 circuits in a vertical orientation. It is suitable for board-to-board mezzanine applications, ensuring superior signal integrity with a maximum data rate of 3.125 Gbps. Constructed from high-quality materials, including a high temperature thermoplastic resin and a combination of copper-nickel-silicon alloy for optimal conductivity, the VHDM receptacle is built to withstand rigorous environments with a temperature range from -55°C to +105°C. Its Durable design includes features suitable for lead-free processes, making it a reliable choice for modern electronic assemblies.

Accommodates up to 80 circuits, ensuring extensive connectivity options

Achieves a maximum data rate of 3.125 Gbps for high-speed data transmission

Constructed with a stack height of 18mm, facilitating Compact design

Durable metal components are plated with gold and matte tin for enhanced performance and longevity

Meets low-halogen and RoHS compliance requirements, supporting eco-friendly initiatives

Designed for easy mating with compatible VHDM headers, optimising assembly processes

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