Amphenol ICC, MEG-Array® 32Gb/s High Density BGA Connector 1.27 mm Pitch Plug Connector, 9 Column, 81 Way
- RS-stocknr.:
- 795-509
- Fabrikantnummer:
- 55714-202LF
- Fabrikant:
- Amphenol ICC
Subtotaal (1 rol van 250 eenheden)*
€ 9.093,77
(excl. BTW)
€ 11.003,46
(incl. BTW)
GRATIS bezorging voor bestellingen van meer dan € 90,00
Voorradig bij de fabrikant
- Klaar voor verzending vanaf 07 december 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Rol(len) | Per rol | Per stuk* |
|---|---|---|
| 1 + | € 9.093,77 | € 36,375 |
*prijsindicatie
- RS-stocknr.:
- 795-509
- Fabrikantnummer:
- 55714-202LF
- Fabrikant:
- Amphenol ICC
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Amphenol ICC | |
| Product Type | Plug Connector | |
| Number of Contacts | 81 | |
| Current | 0.45A | |
| Number of Columns | 9 | |
| Voltage | 200V ac | |
| Housing Material | Liquid Crystal Polymer | |
| Pitch | 1.27mm | |
| Mount Type | Surface | |
| Contact Material | Copper Alloy | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | UL (E66906) | |
| Series | MEG-Array® 32Gb/s High Density BGA Connector | |
| Alles selecteren | ||
|---|---|---|
Merk Amphenol ICC | ||
Product Type Plug Connector | ||
Number of Contacts 81 | ||
Current 0.45A | ||
Number of Columns 9 | ||
Voltage 200V ac | ||
Housing Material Liquid Crystal Polymer | ||
Pitch 1.27mm | ||
Mount Type Surface | ||
Contact Material Copper Alloy | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals UL (E66906) | ||
Series MEG-Array® 32Gb/s High Density BGA Connector | ||
- Land van herkomst:
- US
The Amphenol ICC connector offers a high-density solution is designed for reliable data transmission. It supports flexible ground distribution, ensuring optimal high-speed signal integrity at speeds of up to 32 Gbps, Ideal for various applications.
Patented BGA design enhances self-levelling and self-cantering capabilities
Durability guarantees proven solder joint reliability exceeding 22 years
Available stack heights range from 4mm to 14mm for diverse applications
Supports varying pin counts from 40 to 528 positions
Integrates multiple in-process Vision systems for assured contact integrity
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