TE Connectivity, Economy 800 2.54mm Pitch Vertical 18 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 3A
- RS-stocknr.:
- 745-5053
- Fabrikantnummer:
- 818-AG11D-ESL
- Fabrikant:
- TE Connectivity
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RS heeft dit product niet meer op voorraad.
- RS-stocknr.:
- 745-5053
- Fabrikantnummer:
- 818-AG11D-ESL
- Fabrikant:
- TE Connectivity
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
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Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | TE Connectivity | |
| Number of Contacts | 18 | |
| Mounting Type | Through Hole | |
| Pin Type | Stamped | |
| Pitch | 2.54mm | |
| Row Width | 7.62mm | |
| Frame Type | Open Frame | |
| Termination Method | Solder | |
| Contact Plating | Gold | |
| Current Rating | 3A | |
| Orientation | Vertical | |
| Length | 22.86mm | |
| Width | 10.16mm | |
| Depth | 2.67mm | |
| Dimensions | 22.86 x 10.16 x 2.67mm | |
| Contact Material | Beryllium Copper | |
| Housing Material | PET | |
| Maximum Operating Temperature | +105°C | |
| Minimum Operating Temperature | -55°C | |
| Series | Economy 800 | |
| Alles selecteren | ||
|---|---|---|
Merk TE Connectivity | ||
Number of Contacts 18 | ||
Mounting Type Through Hole | ||
Pin Type Stamped | ||
Pitch 2.54mm | ||
Row Width 7.62mm | ||
Frame Type Open Frame | ||
Termination Method Solder | ||
Contact Plating Gold | ||
Current Rating 3A | ||
Orientation Vertical | ||
Length 22.86mm | ||
Width 10.16mm | ||
Depth 2.67mm | ||
Dimensions 22.86 x 10.16 x 2.67mm | ||
Contact Material Beryllium Copper | ||
Housing Material PET | ||
Maximum Operating Temperature +105°C | ||
Minimum Operating Temperature -55°C | ||
Series Economy 800 | ||
TE Connectivity PCB DIP Sockets with Stamped and Formed Contacts - Economy 800 Series
Economy 800 series PCB DIP sockets with open ladder style frame and 2.54mm centerline. These PCB DIP IC sockets mount vertically and have stamped and formed gold plated contacts with four fingered mating.
Precision four-finger inner contact provides concentric funnel entry for easy flat and round lead insertion
"X" and "Y" Stackable
Open ladder for cooling, cleaning and inspection
Low profile
Accommodates rectangular or round IC leads
Non-wicking, closed bottom sleeve gives 100% protection against flux and solder contamination
Recognized under the Component Program of Underwriters Laboratories, Inc. file No. E111362
Beryllium copper inner contact for maximum mechanical and electrical performance
"X" and "Y" Stackable
Open ladder for cooling, cleaning and inspection
Low profile
Accommodates rectangular or round IC leads
Non-wicking, closed bottom sleeve gives 100% protection against flux and solder contamination
Recognized under the Component Program of Underwriters Laboratories, Inc. file No. E111362
Beryllium copper inner contact for maximum mechanical and electrical performance
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