TE Connectivity 23276 Series Vertical Edge Connector Female, Board, 140-Contacts, 0.6 mm Pitch, 2 Row, Surface Mount

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Subtotaal (1 rol van 350 eenheden)*

€ 3.461,80

(excl. BTW)

€ 4.188,78

(incl. BTW)

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Per stuk*
1 +€ 3.461,80€ 9,891

*prijsindicatie

RS-stocknr.:
474-309
Artikelnummer Distrelec:
304-64-001
Fabrikantnummer:
2327677-7
Fabrikant:
TE Connectivity
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Merk

TE Connectivity

Product Type

Edge Connector

Orientation

Vertical

Current

1.1A

Number of Contacts

140

Number of Rows

2

Connector Gender

Female

Pitch

0.6mm

Mount Type

Board

Contact Plating

Gold

Contact Material

Copper Alloy

Termination Type

Surface Mount

Minimum Operating Temperature

-55°C

Contact Gender

Female

Maximum Operating Temperature

85°C

Standards/Approvals

EU ELV Directive 2000/53/EC Compliant, OCP NIC 3.0, Gen-Z, China RoHS 2 Directive MIIT Order No 32, EU RoHS Directive 2011/65/EU Compliant, 2016

Series

23276

Card Type

PCB Edge Card

The TE Connectivity sliver for Cutting-edge connector designed for reliability and efficiency in electronic applications. This vertical PCB edge card connector boasts 140 positions, making it ideal for high-density configurations. Engineered to meet industry standards like Gen-Z and OCP NIC 3.0, it provides superior performance in signal applications. The surface mount design coupled with robust mechanical attachments ensures stability on printed circuit boards, while its low halogen content aligns with modern environmental standards. Ideal for internal I/O connections, this connector facilitates seamless data transmission, making it a preferred choice among engineers seeking durable and efficient solutions for their electronic assemblies.

Designed for high-frequency signals, enhancing the speed of data transfer

Features a sturdy, vertical orientation that optimizes space on PCBs

Utilizes a tin plating on the contact termination area for improved connection reliability

Offers a wide operating temperature range, ensuring performance in various environmental conditions

Incorporates gold plating in the mating area for enhanced conductivity

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