Trenz Electronic GmbH AM0010-02-3BI21MA ULTRASOM+MPSOC Module Module AMD Zynq UltraScale ZU3EG for Andromeda carrier
- RS-stocknr.:
- 907-752
- Fabrikantnummer:
- AM0010-02-3BI21MA
- Fabrikant:
- Trenz Electronic GmbH
Subtotaal (1 eenheid)*
€ 927,06
(excl. BTW)
€ 1.121,74
(incl. BTW)
GRATIS bezorging voor bestellingen van meer dan € 90,00
Nieuw product (vandaag reserveren)
- Verzending vanaf 23 december 2027
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Aantal stuks | Per stuk |
|---|---|
| 1 + | € 927,06 |
*prijsindicatie
- RS-stocknr.:
- 907-752
- Fabrikantnummer:
- AM0010-02-3BI21MA
- Fabrikant:
- Trenz Electronic GmbH
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Trenz Electronic GmbH | |
| Kit Classification | Module | |
| Programmable Logic Technology | FPGA | |
| Product Type | SoC | |
| For Use With | Andromeda carrier boards | |
| Featured Device | AMD Zynq UltraScale ZU3EG | |
| Kit Name | ULTRASOM+MPSOC Module | |
| Standards/Approvals | RoHS Compliant | |
| Alles selecteren | ||
|---|---|---|
Merk Trenz Electronic GmbH | ||
Kit Classification Module | ||
Programmable Logic Technology FPGA | ||
Product Type SoC | ||
For Use With Andromeda carrier boards | ||
Featured Device AMD Zynq UltraScale ZU3EG | ||
Kit Name ULTRASOM+MPSOC Module | ||
Standards/Approvals RoHS Compliant | ||
- Land van herkomst:
- DE
The Trenz Electronic GmbH Module offers an industrial-grade solution based on AMD Xilinx technology, designed for Advanced applications requiring robust performance and high reliability in embedded systems.
Supports SoC devices ranging from ZU1 to ZU5 for flexible development options
Delivers essential interfaces including Gigabit Ethernet and USB for seamless connectivity
Features up to 32 GB of RAM and various Storage Options including eMMC and HyperFlash
Includes multiple on-board peripherals for enhanced functionality and ease of integration
