Infineon IR2214SSTRPBF MOSFET Gate Driver, 2 A 24-Pin 20V, SSOP
- RS-stocknr.:
- 226-6160
- Fabrikantnummer:
- IR2214SSTRPBF
- Fabrikant:
- Infineon
Subtotaal (2000 eenheden, op een rol van 2000)*
€ 7.190,00
(excl. BTW)
€ 8.700,00
(incl. BTW)
GRATIS bezorging voor bestellingen van meer dan € 90,00
Tijdelijk niet op voorraad
- Verzending vanaf 30 juni 2027
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Aantal stuks | Per stuk | Per rol* |
|---|---|---|
| 2000 + | € 3,595 | € 7.190,00 |
*prijsindicatie
- RS-stocknr.:
- 226-6160
- Fabrikantnummer:
- IR2214SSTRPBF
- Fabrikant:
- Infineon
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Infineon | |
| Product Type | Gate Driver | |
| Output Current | 2A | |
| Pin Count | 24 | |
| Package Type | SSOP | |
| Fall Time | 7ns | |
| Driver Type | MOSFET | |
| Number of Outputs | 4 | |
| Rise Time | 24ns | |
| Minimum Supply Voltage | 11.5V | |
| Maximum Supply Voltage | 20V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 125°C | |
| Length | 8.5mm | |
| Standards/Approvals | No | |
| Width | 5.6mm | |
| Height | 2mm | |
| Series | IR2214 | |
| Mount Type | Surface | |
| Automotive Standard | No | |
| Alles selecteren | ||
|---|---|---|
Merk Infineon | ||
Product Type Gate Driver | ||
Output Current 2A | ||
Pin Count 24 | ||
Package Type SSOP | ||
Fall Time 7ns | ||
Driver Type MOSFET | ||
Number of Outputs 4 | ||
Rise Time 24ns | ||
Minimum Supply Voltage 11.5V | ||
Maximum Supply Voltage 20V | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 125°C | ||
Length 8.5mm | ||
Standards/Approvals No | ||
Width 5.6mm | ||
Height 2mm | ||
Series IR2214 | ||
Mount Type Surface | ||
Automotive Standard No | ||
Infineon IR2214 Series Gate Driver, 11.5V Minimum Supply Voltage, 2A Output Current - IR2214SSTRPBF
This gate driver is a surface-mount MOSFET driver IC designed to Interface low-voltage control logic with power switches in electronic systems. It operates from a low supply threshold and supports multi-output driving for Compact power stages, functioning across a wide ambient temperature range for demanding environments.
Features and Benefits:
• Operates from 11.5V allowing low-voltage system compatibility
• Supports up to 20V supply for increased gate-drive amplitude
• Four outputs enabling multi-channel switching control
• 2A output current for effective gate charge delivery
• Fast fall time of 7ns to reduce switching losses
• Rise time of 24ns aiding predictable switching behaviour
• Supports up to 20V supply for increased gate-drive amplitude
• Four outputs enabling multi-channel switching control
• 2A output current for effective gate charge delivery
• Fast fall time of 7ns to reduce switching losses
• Rise time of 24ns aiding predictable switching behaviour
Applications
• Suitable for multi-phase power conversion stages
• Ideal for driving MOSFET banks in motor controllers
• Used with synchronous buck converters for gate control
• Can be used for Compact surface-mount power modules
• Used for temperature-stable switching in harsh environments
• Ideal for driving MOSFET banks in motor controllers
• Used with synchronous buck converters for gate control
• Can be used for Compact surface-mount power modules
• Used for temperature-stable switching in harsh environments
What package type should I plan for in PCB layout?
It is supplied in an SSOP package with 24 pins, so design pad and solder mask clearances to suit a 24-pin SSOP footprint.
What environmental limits must be considered for thermal design?
The device is rated to operate between -40°C and 125°C, so thermal management should account for maximum ambient and power dissipation at 125°C.
How many switching channels are available for parallel or independent control?
There are four independent outputs, permitting either parallel drive configurations or separate channel control.
What mounting method is required for assembly?
The component is intended for surface mounting, so standard SMD reflow processes are appropriate.
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