Transcend HSD460I Half-Slim Internal SSD
- RS-stocknr.:
- 262-9671
- Fabrikantnummer:
- TS128GHSD460I
- Fabrikant:
- Transcend
Subtotaal (1 eenheid)*
€ 179,33
(excl. BTW)
€ 216,99
(incl. BTW)
GRATIS bezorging voor bestellingen van meer dan € 90,00
Op voorraad
- 3 stuk(s) klaar voor verzending vanaf een andere locatie
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Aantal stuks | Per stuk |
|---|---|
| 1 + | € 179,33 |
*prijsindicatie
- RS-stocknr.:
- 262-9671
- Fabrikantnummer:
- TS128GHSD460I
- Fabrikant:
- Transcend
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Transcend | |
| Product Type | SSD | |
| Model Number | HSD460I | |
| Internal/External | Internal | |
| Industrial Grade | Yes | |
| Form Factor | Half-Slim | |
| NAND Type | 3D TLC | |
| Interface Type | SATA III | |
| Maximum Operating Temperature | 85°C | |
| Minimum Operating Temperature | -40°C | |
| Standards/Approvals | JEDEC MO-297 | |
| Alles selecteren | ||
|---|---|---|
Merk Transcend | ||
Product Type SSD | ||
Model Number HSD460I | ||
Internal/External Internal | ||
Industrial Grade Yes | ||
Form Factor Half-Slim | ||
NAND Type 3D TLC | ||
Interface Type SATA III | ||
Maximum Operating Temperature 85°C | ||
Minimum Operating Temperature -40°C | ||
Standards/Approvals JEDEC MO-297 | ||
Vrijgesteld
Transcend 128GB Half-slim MO-297 SATA III Wide Temperature SSD -HSD460I
Transcend's HSD460I half-slim SSD is built with 112 layers of 3D NAND flash and the SATA III 6Gb/s interface, delivering never-before-seen transfer speeds. Applied with the Corner Bond technology and anti-sulfur resistor, the HSD460I is fortified to withstand demanding industrial applications. Following JEDEC's MO-297 standard, the HSD460I is fully tested in-house and is able to operate in wide operating temperatures ranging from -40℃∼85℃, ideal for read-heavy applications and space-limited mobile devices such as industrial control systems, medical equipment, mobile devices, and POS terminals.
Hardware Features
Compliant with JEDEC MO-297
Anti-sulfur technology implemented to prevent sulfurization in the
environment
Key components fortified by default with Corner Bond technology
Promised operational reliability in a wide temperature range (from -40°C
to 85°C)
Firmware Features
Dynamic thermal throttling
Built-in LDPC ECC (Error Correction Code) functionality
Advanced Global Wear-Leveling and Block management for reliability
Supports S.M.A.R.T. function to conduct health monitoring, analysis, and
reporting for storage devices
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