Fischer Elektronik Heatsink, Universal Square Alu 10 mm 35 mm 35mm
- RS-stocknr.:
- 674-4765
- Fabrikantnummer:
- ICK BGA 35x35x10
- Fabrikant:
- Fischer Elektronik
Bulkkorting beschikbaar
Bekijk bulkkortingSubtotaal (1 eenheid)*
€ 3,23
(excl. BTW)
€ 3,91
(incl. BTW)
GRATIS bezorging voor bestellingen van meer dan € 90,00
Op voorraad
- 177 stuk(s) klaar voor verzending
- 234 stuk(s) klaar voor verzending vanaf een andere locatie
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Aantal stuks | Per stuk |
|---|---|
| 1 - 9 | € 3,23 |
| 10 - 24 | € 2,98 |
| 25 - 49 | € 2,85 |
| 50 - 99 | € 2,74 |
| 100 + | € 2,52 |
*prijsindicatie
- RS-stocknr.:
- 674-4765
- Fabrikantnummer:
- ICK BGA 35x35x10
- Fabrikant:
- Fischer Elektronik
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Fischer Elektronik | |
| For Use With | Universal Square Alu | |
| Product Type | Heatsink | |
| Length | 35mm | |
| Width | 35mm | |
| Height | 10mm | |
| Fastening | Clamp, Glue, Integrated clamp, Screw, Thermally conductive adhesive | |
| Colour | Black | |
| Finish | Black Anodised | |
| Compatible Package Type | BGA | |
| Standards/Approvals | No | |
| Material | Aluminium | |
| Application | Heat Sink For Power PC, Semiconductor, Technical Introduction, Heatsink for PGA, SMD, Fan, Hole Pattern, Thermal, Heat Sink For 3 II Mobile Module, Heat Sink For IC, Cooler, Heat Sink For Microprocessor, Heat Sink For Bga, Pin Heat Sinks, Heat Sink For Dil/Ic, Processor Overview, Heat Sink For PLCC | |
| Alles selecteren | ||
|---|---|---|
Merk Fischer Elektronik | ||
For Use With Universal Square Alu | ||
Product Type Heatsink | ||
Length 35mm | ||
Width 35mm | ||
Height 10mm | ||
Fastening Clamp, Glue, Integrated clamp, Screw, Thermally conductive adhesive | ||
Colour Black | ||
Finish Black Anodised | ||
Compatible Package Type BGA | ||
Standards/Approvals No | ||
Material Aluminium | ||
Application Heat Sink For Power PC, Semiconductor, Technical Introduction, Heatsink for PGA, SMD, Fan, Hole Pattern, Thermal, Heat Sink For 3 II Mobile Module, Heat Sink For IC, Cooler, Heat Sink For Microprocessor, Heat Sink For Bga, Pin Heat Sinks, Heat Sink For Dil/Ic, Processor Overview, Heat Sink For PLCC | ||
- Land van herkomst:
- DE
Fischer Elektronik ICK BGA Series Heatsink
ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).
Features and Benefits
Black anodised surface.
Heatsink dimensions match respective BGA-type.
Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).
BGA Heatsinks
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