Fischer Elektronik Heatsink, Universal Round Alu, 4.25°C/W 18.5 mm
- RS-stocknr.:
- 674-4832
- Fabrikantnummer:
- ICK S R 28,5x18,5
- Fabrikant:
- Fischer Elektronik
Bulkkorting beschikbaar
Subtotaal (1 eenheid)*
€ 10,82
(excl. BTW)
€ 13,09
(incl. BTW)
GRATIS bezorging voor bestellingen van meer dan € 90,00
Op voorraad
- Plus verzending 4 stuk(s) vanaf 16 april 2026
- Plus verzending 2 stuk(s) vanaf 16 april 2026
- Plus verzending 25 stuk(s) vanaf 23 april 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Aantal stuks | Per stuk |
|---|---|
| 1 - 9 | € 10,82 |
| 10 - 24 | € 9,96 |
| 25 - 49 | € 9,54 |
| 50 - 99 | € 9,20 |
| 100 + | € 8,45 |
*prijsindicatie
- RS-stocknr.:
- 674-4832
- Fabrikantnummer:
- ICK S R 28,5x18,5
- Fabrikant:
- Fischer Elektronik
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Fischer Elektronik | |
| For Use With | Universal Round Alu | |
| Product Type | Heatsink | |
| Height | 18.5mm | |
| Thermal Resistance | 4.25°C/W | |
| Fastening | Clamp, Glue, Integrated clamp, Screw | |
| Colour | Black | |
| Finish | Black Anodised | |
| Compatible Package Type | PLCC, DIL/IC, PGA, BGA, LED, SMD | |
| Standards/Approvals | No | |
| Material | Aluminium Alloy, Thermally Conductive Glue, Thermally Conductive Foil | |
| Application | Heat Sink For Pentium II Mobile Module, Heat Sink For IC, Heat Sink For Power PC, Heat Sink For Microprocessor, Heat Sink For Pentium III/Xeon, Heat Sink For Dil and Ic, Heat Sink For PLCC, Heat Sink For Bga, Heat Sink For Pentium Pro, Fan, SMD, Cooler, Heatsink for PGA | |
| Alles selecteren | ||
|---|---|---|
Merk Fischer Elektronik | ||
For Use With Universal Round Alu | ||
Product Type Heatsink | ||
Height 18.5mm | ||
Thermal Resistance 4.25°C/W | ||
Fastening Clamp, Glue, Integrated clamp, Screw | ||
Colour Black | ||
Finish Black Anodised | ||
Compatible Package Type PLCC, DIL/IC, PGA, BGA, LED, SMD | ||
Standards/Approvals No | ||
Material Aluminium Alloy, Thermally Conductive Glue, Thermally Conductive Foil | ||
Application Heat Sink For Pentium II Mobile Module, Heat Sink For IC, Heat Sink For Power PC, Heat Sink For Microprocessor, Heat Sink For Pentium III/Xeon, Heat Sink For Dil and Ic, Heat Sink For PLCC, Heat Sink For Bga, Heat Sink For Pentium Pro, Fan, SMD, Cooler, Heatsink for PGA | ||
- Land van herkomst:
- DE

ICK S R Series
Round heatsinks for ICs, which are also designed for use with LEDs (see also ICK LED R heatsinks, typical SN 674-4771 )
Al-natural surface
Mounting by clamp, foil or adhesive
PGA Heatsinks
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