AAVID THERMALLOY Heatsink, Thin Components, Power Semiconductors, Sensors, 0.93°C/W 85.5 mm 150 mm 49.5mm
- RS-stocknr.:
- 712-4352
- Fabrikantnummer:
- 0SA36/50/B
- Fabrikant:
- AAVID THERMALLOY
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€ 15,87
(excl. BTW)
€ 19,20
(incl. BTW)
GRATIS bezorging voor bestellingen van meer dan € 90,00
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- Verzending 30 stuk(s) vanaf 03 februari 2027
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Aantal stuks | Per stuk |
|---|---|
| 1 - 9 | € 15,87 |
| 10 - 24 | € 14,60 |
| 25 - 49 | € 13,97 |
| 50 - 99 | € 13,50 |
| 100 + | € 12,37 |
*prijsindicatie
- RS-stocknr.:
- 712-4352
- Fabrikantnummer:
- 0SA36/50/B
- Fabrikant:
- AAVID THERMALLOY
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | AAVID THERMALLOY | |
| For Use With | Thin Components, Power Semiconductors, Sensors | |
| Product Type | Heatsink | |
| Length | 150mm | |
| Width | 49.5mm | |
| Height | 85.5mm | |
| Fastening | Clip | |
| Thermal Resistance | 0.93°C/W | |
| Colour | Black Anodised | |
| Finish | Black Anodised, Nickel Plated | |
| Compatible Package Type | TO-0247, TO-0247J, TO-0218, TO-0220, TO-220, TO-247 | |
| Standards/Approvals | U.S. Patent 5.991.151 | |
| Material | Nickel Plated, Special Spring Steel | |
| Application | Cooling | |
| Alles selecteren | ||
|---|---|---|
Merk AAVID THERMALLOY | ||
For Use With Thin Components, Power Semiconductors, Sensors | ||
Product Type Heatsink | ||
Length 150mm | ||
Width 49.5mm | ||
Height 85.5mm | ||
Fastening Clip | ||
Thermal Resistance 0.93°C/W | ||
Colour Black Anodised | ||
Finish Black Anodised, Nickel Plated | ||
Compatible Package Type TO-0247, TO-0247J, TO-0218, TO-0220, TO-220, TO-247 | ||
Standards/Approvals U.S. Patent 5.991.151 | ||
Material Nickel Plated, Special Spring Steel | ||
Application Cooling | ||
The Max Clip System™ OSA36 Profile
Clip mounting technology offers high reliability
Economic and manufacturing benefits that replace rivets and screws
Simplified and rapid assembly for mounting a semiconductor to the heatsink
Improved performance with the use of special thermal interface materials
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