TE Connectivity 2.54 mm Pitch 28 Way DIP IC Socket

Subtotal (1 tube of 40 units)*

€ 250,19

(exc. VAT)

€ 302,73

(inc. VAT)

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  • Verzending vanaf 11 maart 2026
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Tube(s)
Per Tube
Per unit*
1 +€ 250,19€ 6,255

*price indicative

RS Stock No.:
472-621
Distrelec Article No.:
304-59-131
Mfr. Part No.:
1571551-9
Brand:
TE Connectivity
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Merk

TE Connectivity

IC Socket Type

DIP

Product Type

IC Socket

Number of Contacts

28

Current

3A

Number of Rows

2

Pitch

2.54mm

Orientation

Vertical

Contact Material

Beryllium Copper Alloy

Contact Plating

Tin

Termination Type

Solder

Row Pitch

2.54mm

Device Mount Type

Board

Maximum Operating Temperature

265°C

Standards/Approvals

UL 94 V-0

Housing Material

Thermoplastic Polyester

COO (Country of Origin):
CH
The TE Connectivity DIP socket is an exemplary choice for your circuit applications, delivering reliable connections in a compact form factor. Engineered with precision, this product features a closed frame style that enhances durability while maintaining optimal performance. Created for vertical PCB mount orientation, it allows for seamless integration into your electronic assemblies. The standard connector profile guarantees compatibility with a wide range of designs, while its thoughtfully selected materials ensure integrity over time. With advanced features such as four-fingered mating contact types and beryllium copper construction, this socket stands out in terms of both functionality and reliability. Ideal for hobbyists and professionals alike, this product assures long-lasting operational excellence.

Polarisation ensures correct mating alignment for easy installation

Designed with a standard sleeve material for enhanced performance

Board mount connector type simplifies integration into existing circuits

Quick and straightforward through-hole solder termination method

Robust mechanical attachment guarantees stability in demanding environments

Meets stringent UL and EU compliance standards for safety

Black thermoplastic polyester housing for improved aesthetic compatibility

Reduced contact resistance promotes efficient signal transmission

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