Amphenol Communications Solutions 1.27 mm Pitch 400 Way Surface Mount Surface Prototyping IC Socket
- RS-stocknr.:
- 182-2279
- Fabrikantnummer:
- 74221-101LF
- Fabrikant:
- Amphenol Communications Solutions
Subtotaal (1 rol van 250 eenheden)*
€ 6.167,25
(excl. BTW)
€ 7.462,25
(incl. BTW)
GRATIS bezorging voor bestellingen van meer dan € 90,00
Tijdelijk niet op voorraad
- Verzending vanaf 08 maart 2027
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Aantal stuks | Per stuk | Per rol* |
|---|---|---|
| 250 + | € 24,669 | € 6.167,25 |
*prijsindicatie
Alternatief
Dit product is momenteel niet beschikbaar. Hierbij onze aanbeveling voor een alternatief product.
Per stuk
€ 33,33
(excl. BTW)
€ 40,33
(incl. BTW)
- RS-stocknr.:
- 182-2279
- Fabrikantnummer:
- 74221-101LF
- Fabrikant:
- Amphenol Communications Solutions
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Amphenol Communications Solutions | |
| IC Socket Type | Prototyping Socket | |
| Package Type | Surface Mount | |
| Product Type | IC Socket | |
| Current | 450mA | |
| Number of Contacts | 400 | |
| Number of Rows | 8 | |
| Pitch | 1.27mm | |
| Voltage | 200V | |
| Orientation | Straight | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Socket Mount Type | Surface | |
| Minimum Operating Temperature | -55°C | |
| Device Mount Type | Surface | |
| Termination Type | Solder | |
| Row Pitch | 1.27mm | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | No | |
| Series | Meg-Array | |
| Housing Material | Liquid Crystal Polymer | |
| Alles selecteren | ||
|---|---|---|
Merk Amphenol Communications Solutions | ||
IC Socket Type Prototyping Socket | ||
Package Type Surface Mount | ||
Product Type IC Socket | ||
Current 450mA | ||
Number of Contacts 400 | ||
Number of Rows 8 | ||
Pitch 1.27mm | ||
Voltage 200V | ||
Orientation Straight | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Socket Mount Type Surface | ||
Minimum Operating Temperature -55°C | ||
Device Mount Type Surface | ||
Termination Type Solder | ||
Row Pitch 1.27mm | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals No | ||
Series Meg-Array | ||
Housing Material Liquid Crystal Polymer | ||
- Land van herkomst:
- US
High density, high speed, discrete contact, array connector
Flexible ground distribution optimizes high speed signal integrity
10Gb/s differential pair performance with under 1% cross-talk
28Gb/s high speed performance documented for 4 mm and 6 mm stack height
Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market
1.27 mm x 1.27 mm grid provides 71 contacts per cm2 density to save space
Dual-point, long wipe contacts Wide range of sizes and PCB stack heights increase mechanical design flexibility
6 PCB Stack heights: 4 mm to 14mm
8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform
High density standard BGA attachment lower assembly costs by using standard SMT processes
BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage
Patented BGA contact attachment preserves solder ball positioning
Optimized PCB routing enhances electrical performance ball positioning Quality and Reliability
Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options
400 Position BGA Receptacle, 4 mm Component Height, 1.27 mm x 1.27 mm Array, Lead-free
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