TE Connectivity 1366 Way LGA Prototyping IC Socket

Subtotaal (1 tray van 12 eenheden)*

€ 261,38

(excl. BTW)

€ 316,27

(incl. BTW)

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  • Verzending vanaf 11 maart 2026
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Tray(s)
Per tray
Per stuk*
1 +€ 261,38€ 21,782

*prijsindicatie

RS-stocknr.:
478-441
Artikelnummer Distrelec:
304-49-467
Fabrikantnummer:
1981837-2
Fabrikant:
TE Connectivity
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Merk

TE Connectivity

IC Socket Type

Prototyping Socket

Package Type

LGA

Product Type

IC Socket

Number of Contacts

1366

Contact Plating

Gold

Maximum Operating Temperature

260°C

Standards/Approvals

EU REACH Regulation (EC) No. 1907/2006, China RoHS 2 Directive MIIT Order No 32, EU RoHS Directive 2011/65/EU Compliant, EU ELV Directive 2000/53/EC Compliant, 2016 No Restricted Materials Above Threshold

Land van herkomst:
CN
The TE Connectivity Socket assembly LGA1366, designed specifically for high-performance computing applications, delivers reliable connectivity with an emphasis on durability and efficiency. Constructed to accommodate various operational requirements, this component supports seamless integration in advanced configurations. With a focus on compliance, the design adheres to critical industry standards, making it ideal for use in environments where regulatory adherence is paramount. This product stands out in its ability to maintain efficient thermal management and electrical performance under demanding conditions, catering to the needs of engineers and designers alike. Its low halogen content further enhances its environmental credentials, ensuring it meets modern sustainability expectations.

Designed to support sophisticated LGA1366 processor configurations

Low halogen content ensures compliance with environmental regulations

Built for reliable thermal management during high-stress operations

Facilitates easy integration with existing modular systems

Constructed for enhanced durability, adapting to various industrial applications

Backed by comprehensive compliance documentation for peace of mind

Optimised for reflow solder processes with high-temperature capabilities

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