TDK 2.2 μF Multilayer Ceramic Capacitor, 100V dc, ±10 %, Surface
- RS-stocknr.:
- 179-5149
- Fabrikantnummer:
- C3216X7S2A225K160AE
- Fabrikant:
- TDK
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- RS-stocknr.:
- 179-5149
- Fabrikantnummer:
- C3216X7S2A225K160AE
- Fabrikant:
- TDK
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | TDK | |
| Capacitance | 2.2μF | |
| Product Type | Multilayer Ceramic Capacitor | |
| Voltage | 100V dc | |
| Package/Case | 1206 | |
| Mount Type | Surface | |
| Packaging | Tape & Reel | |
| Dielectric | X7S | |
| Tolerance | ±10 % | |
| Automotive Standard | No | |
| Termination Type | Surface Mount | |
| Minimum Operating Temperature | -55°C | |
| Series | C | |
| Width | 1.6mm | |
| Standards/Approvals | No | |
| Length | 3.2mm | |
| Height | 1.6mm | |
| Suppression Class | Class II | |
| Maximum Operating Temperature | 125°C | |
| Alles selecteren | ||
|---|---|---|
Merk TDK | ||
Capacitance 2.2μF | ||
Product Type Multilayer Ceramic Capacitor | ||
Voltage 100V dc | ||
Package/Case 1206 | ||
Mount Type Surface | ||
Packaging Tape & Reel | ||
Dielectric X7S | ||
Tolerance ±10 % | ||
Automotive Standard No | ||
Termination Type Surface Mount | ||
Minimum Operating Temperature -55°C | ||
Series C | ||
Width 1.6mm | ||
Standards/Approvals No | ||
Length 3.2mm | ||
Height 1.6mm | ||
Suppression Class Class II | ||
Maximum Operating Temperature 125°C | ||
- Land van herkomst:
- JP
TDK multilayer ceramic chip capacitor_Soft termination_General grade_C series is a product which conductive resin layers are included in terminations. Soft termination series has higher mechanical endurance by the flexible resin layers which absorbs thermal and mechanical stress.
FEATURES
Higher mechanical endurance is realized by flexible resin layers.
X8R type which maximum temperature is up to 150°C is applicable.
C0G temperature characteristic which has excellent stable temperature and DC-bias characteristics is applicable.
APPLICATIONS
Fail-safe design in battery line.
Prevention of ceramic body cracks by board bending.
Prevention of solder cracks by thermal shock.
The set having a high probability of fall.
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