Samsung Electro-Mechanics 2.2 μF Multilayer Ceramic Capacitor, 16V dc, ±10 %, Surface
- RS-stocknr.:
- 766-6723
- Fabrikantnummer:
- CL31B225KOHNNNE
- Fabrikant:
- Samsung Electro-Mechanics
Momenteel niet beschikbaar
We weten niet of dit item nog op voorraad komt, RS is van plan dit binnenkort uit ons assortiment te halen.
- RS-stocknr.:
- 766-6723
- Fabrikantnummer:
- CL31B225KOHNNNE
- Fabrikant:
- Samsung Electro-Mechanics
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
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Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Samsung Electro-Mechanics | |
| Capacitance | 2.2μF | |
| Product Type | Multilayer Ceramic Capacitor | |
| Voltage | 16V dc | |
| Construction | Stacked | |
| Package/Case | 1206 | |
| Mount Type | Surface | |
| Dielectric | X7R | |
| Tolerance | ±10 % | |
| Automotive Standard | AEC-Q200 | |
| Termination Type | Surface Mount | |
| Minimum Operating Temperature | -55°C | |
| Series | CL | |
| Height | 1.6mm | |
| Standards/Approvals | RoHS | |
| Width | 1.6mm | |
| Length | 3.2mm | |
| Suppression Class | X7R | |
| Maximum Operating Temperature | 125°C | |
| Alles selecteren | ||
|---|---|---|
Merk Samsung Electro-Mechanics | ||
Capacitance 2.2μF | ||
Product Type Multilayer Ceramic Capacitor | ||
Voltage 16V dc | ||
Construction Stacked | ||
Package/Case 1206 | ||
Mount Type Surface | ||
Dielectric X7R | ||
Tolerance ±10 % | ||
Automotive Standard AEC-Q200 | ||
Termination Type Surface Mount | ||
Minimum Operating Temperature -55°C | ||
Series CL | ||
Height 1.6mm | ||
Standards/Approvals RoHS | ||
Width 1.6mm | ||
Length 3.2mm | ||
Suppression Class X7R | ||
Maximum Operating Temperature 125°C | ||
Samsung 1206 MLCC series reels
1206 Range
C0G (NP0) is the most popular formulation of the "temperature-compensating", EIA Class I ceramic materials
X7R formulations are called "temperature stable" ceramics and fall into EIA Class II materials
Y5V formulations are for general-purpose use in a limited temperature range.These characteristics make Y5V ideal for decoupling applications
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