Vishay Type N-Channel MOSFET, 12 A, 30 V, 8-Pin PowerPAK 1212-8

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€ 1.050,00

(excl. BTW)

€ 1.260,00

(incl. BTW)

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RS-stocknr.:
180-7358
Fabrikantnummer:
SIS412DN-T1-GE3
Fabrikant:
Vishay
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Merk

Vishay

Product Type

MOSFET

Channel Type

Type N

Maximum Continuous Drain Current Id

12A

Maximum Drain Source Voltage Vds

30V

Package Type

PowerPAK 1212-8

Mount Type

Surface

Pin Count

8

Maximum Drain Source Resistance Rds

0.03Ω

Forward Voltage Vf

1.2V

Minimum Operating Temperature

-55°C

Maximum Power Dissipation Pd

15.6W

Typical Gate Charge Qg @ Vgs

3.8nC

Maximum Operating Temperature

150°C

Length

3.61mm

Standards/Approvals

IEC 61249-2-21

Height

0.79mm

Automotive Standard

No

Land van herkomst:
CN

Vishay MOSFET, 30V Maximum Drain Source Voltage, 12A Maximum Continuous Drain Current - SIS412DN-T1-GE3


This n-channel MOSFET is a surface-mount switching device designed for power control in industrial and electronic systems. It operates as a low-voltage switch for managing currents in automation, power conversion and drive stages while meeting standard PCB manufacturing practices.

Features and Benefits:


• 12A continuous drain current for sustained load handling • 30V drain-source rating enabling low-voltage power stages • 0.03Ω Rds(on) minimises conduction losses and heating • 3.8nC typical gate charge for efficient switching performance • 15.6W power dissipation supports high-power SMD applications • -55°C to 150°C operating range for wide-temperature environments

Applications


• Suitable for motor controller low-voltage stages in automation • Ideal for DC-DC converter output switches in power supplies • Used for solid-state load switching in industrial control panels • Can be used for high-current switch nodes on Compact SMD boards

What gate tolerance should be observed during drive design?


The device can tolerate gate voltages up to 20V so gate-drive circuitry should be limited within that range to prevent damage.

How does thermal management affect continuous operation?


With 15.6W maximum dissipation, adequate PCB copper and thermal vias are required to maintain junction temperatures under heavy continuous current.

What package considerations apply for assembly and layout?


The component is supplied in an eight-pin PowerPAK 1212-8 surface package, so footprint and soldering profiles must match that SMD outline for reliable mounting.

Is this component appropriate for automotive-certified designs?


It is not specified as automotive-standard compliant, so it should be treated as an alternative where automotive certification is not mandatory.

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