Infineon iPB N-Channel MOSFET, 273 A, 100 V N, 3-Pin TO-263 IPB048N15N5LFATMA1

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€ 3.864,00

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RS-stocknr.:
242-5820
Fabrikantnummer:
IPB048N15N5LFATMA1
Fabrikant:
Infineon
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Merk

Infineon

Channel Type

N

Product Type

MOSFET

Maximum Continuous Drain Current Id

273A

Maximum Drain Source Voltage Vds

100V

Package Type

TO-263

Series

iPB

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

1.7mΩ

Channel Mode

N

Maximum Power Dissipation Pd

81W

Minimum Operating Temperature

-55°C

Forward Voltage Vf

1.2V

Maximum Gate Source Voltage Vgs

20V

Typical Gate Charge Qg @ Vgs

80nC

Maximum Operating Temperature

+150°C

Standards/Approvals

RoHS

Automotive Standard

No

Infineon iPB Series MOSFET, 100V Maximum Drain Source Voltage, 273A Maximum Continuous Drain Current - IPB048N15N5LFATMA1


This n-channel MOSFET is a power switching device designed for high-current, high-voltage applications where robust thermal and electrical performance is required. It operates across a wide ambient range and is supplied in a surface-mount TO-263 package suitable for heat-managed PCBs. The device is RoHS-compliant and intended for systems requiring substantial continuous drain capability and controlled gate drive.

Features and Benefits:


• 100V drain-source withstand enabling high-voltage switching
• 273A continuous drain current for heavy-load handling
• 1.7mΩ low Rds(on) reducing conduction losses
• 81W power dissipation supporting high-power operation
• 80nC total gate charge for predictable switching energy
• 1.2V forward voltage minimising diode conduction drop

Applications


• Suitable for high-current power supplies and converters
• Ideal for motor-drive stages requiring large current
• Used for server power distribution and bus switching
• Can be used for telecom rectifiers and inverters
• Appropriate for industrial switching in harsh temperatures

What gate voltage limits must be observed for safe operation?


The gate should not exceed a 20V Vgs limit to prevent gate damage.

How does it tolerate extreme thermal environments?


It is specified to operate from -55°C up to +150°C for wide temperature-range use.

What mounting method is required for assembly?


The device is intended for surface mounting in a TO-263 footprint.

What conduction behaviour can designers expect from the intrinsic diode?


The forward conduction characteristic is specified as 1.2V Vf for diode-related current flow.

Which channel polarity does the device present for circuit integration?


It uses an N-channel configuration for conventional high-side or low-side switching.

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