TE Connectivity AMPMODU Series Vertical Board PCB Header, 8 Contact(s), 1.27 mm Pitch, 1 Row, Unshrouded

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€ 268,78

(excl. BTW)

€ 325,22

(incl. BTW)

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  • Verzending vanaf 23 februari 2026
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RS-stocknr.:
478-123
Artikelnummer Distrelec:
304-50-850
Fabrikantnummer:
5-104178-5
Fabrikant:
TE Connectivity
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Merk

TE Connectivity

Series

AMPMODU

Product Type

PCB Header

Pitch

1.27mm

Current

3.6A

Housing Material

Liquid Crystal Polymer

Number of Contacts

8

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Plating

Gold

Contact Material

Copper Alloy

Row Pitch

1.27mm

Termination Type

Solder

Minimum Operating Temperature

65°C

Tail Pin Length

2.54mm

Maximum Operating Temperature

105°C

Standards/Approvals

RoHS

Voltage

30 V

Land van herkomst:
MX
The TE Connectivity PCB Mount Header is engineered for versatile board-to-board connections, optimising space and enhancing functionality in your projects. With a sleek vertical orientation, this component supports seamless integration in designs that prioritise efficiency. Featuring eight positions on a 1.27 mm centreline, it ensures a secure and stable connection while accommodating various applications in electronic assemblies. Constructed with high-quality materials, this unshrouded header is designed for through-hole soldering, guaranteeing a robust and durable attachment to printed circuit boards. Its excellent compatibility with AMPMODU System 50 exemplifies its adaptability, making it an ideal choice for modern electronics requiring reliable signal transmission.

Offers a parallel board-to-board configuration for increased layout flexibility

Designed with an operating temperature range that supports demanding environments

Facilitates high current delivery, ensuring robust performance in a compact form

Constructed from low halogen materials, contributing to environmentally friendly practices

Assures compatibility with both UL and CSA standards for trustworthy quality assurance

Includes a retention mechanism to enhance stability during operation

Supports a high insulation resistance value, ensuring minimal signal loss

Provides an efficient mating interface, enhancing connection security

Engineered for easy integration into various electronic applications

Available in bulk packaging for convenient procurement

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