Samtec CLP Series Horizontal Surface PCB Socket, 60-Contact, 2 Row, 1.27 mm Pitch Solder
- RS-stocknr.:
- 227-1079
- Fabrikantnummer:
- CLP-130-02-L-D-P-TR
- Fabrikant:
- Samtec
Momenteel niet beschikbaar
We weten niet of dit item nog op voorraad komt, RS is van plan dit binnenkort uit ons assortiment te halen.
- RS-stocknr.:
- 227-1079
- Fabrikantnummer:
- CLP-130-02-L-D-P-TR
- Fabrikant:
- Samtec
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Samtec | |
| Number of Contacts | 60 | |
| Product Type | PCB Socket | |
| Sub Type | Dual Wipe Socket | |
| Number of Rows | 2 | |
| Pitch | 1.27mm | |
| Current | 3.4A | |
| Termination Type | Solder | |
| Housing Material | Liquid Crystal Polymer | |
| Mount Type | Surface | |
| Orientation | Horizontal | |
| Connector System | Board-to-Board | |
| Voltage | 395 V | |
| Series | CLP | |
| Minimum Operating Temperature | -55°C | |
| Row Pitch | 1.27mm | |
| Contact Material | Phosphor Bronze | |
| Maximum Operating Temperature | 125°C | |
| Contact Plating | Gold | |
| Standards/Approvals | No | |
| Alles selecteren | ||
|---|---|---|
Merk Samtec | ||
Number of Contacts 60 | ||
Product Type PCB Socket | ||
Sub Type Dual Wipe Socket | ||
Number of Rows 2 | ||
Pitch 1.27mm | ||
Current 3.4A | ||
Termination Type Solder | ||
Housing Material Liquid Crystal Polymer | ||
Mount Type Surface | ||
Orientation Horizontal | ||
Connector System Board-to-Board | ||
Voltage 395 V | ||
Series CLP | ||
Minimum Operating Temperature -55°C | ||
Row Pitch 1.27mm | ||
Contact Material Phosphor Bronze | ||
Maximum Operating Temperature 125°C | ||
Contact Plating Gold | ||
Standards/Approvals No | ||
The Samtec CLP series 1.27mm low profile dual wipe socket has 30 positions and surface mount lead style. It has 0.000254mm light selective gold in contact area and matte tin on tail.
Dual row
Pick & place pad
Alignment Pin
Tape and reel packaging
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