STMicroelectronics Demonstration Board Power Management for VNI8200XP for High Side Driver
- RS-stocknr.:
- 196-1763
- Fabrikantnummer:
- STEVAL-IFP022V1
- Fabrikant:
- STMicroelectronics
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We weten niet of dit item nog op voorraad komt, RS is van plan dit binnenkort uit ons assortiment te halen.
- RS-stocknr.:
- 196-1763
- Fabrikantnummer:
- STEVAL-IFP022V1
- Fabrikant:
- STMicroelectronics
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | STMicroelectronics | |
| Product Type | Power Management Development Kit | |
| Power Management Function | Power Management | |
| For Use With | High Side Driver | |
| Kit Classification | Evaluation Board | |
| Featured Device | VNI8200XP | |
| Kit Name | Demonstration Board | |
| Standards/Approvals | RoHS | |
| Alles selecteren | ||
|---|---|---|
Merk STMicroelectronics | ||
Product Type Power Management Development Kit | ||
Power Management Function Power Management | ||
For Use With High Side Driver | ||
Kit Classification Evaluation Board | ||
Featured Device VNI8200XP | ||
Kit Name Demonstration Board | ||
Standards/Approvals RoHS | ||
- Land van herkomst:
- IT
The STEVAL-IFP022V1 demonstration board is based on VNI8200XP high-side driver. It was developed as an instrument to test device functionality in terms of power management and digital interface. The boards isolated interface between the IPS and host controller were implemented using high-speed opto-couplers for IPS driving, and low-speed opto-couplers to receive device status information. The connection is achieved through a 30-pin connector.
To provide a user-friendly way to test VNI8200XP device functionality, a GUI interface was developed. To use the GUI it is necessary to connect the STEVAL-IFP022V1 demonstration board to a PC by using a communication board.
Thermal performance is improved thanks to a four-layer structure which makes it possible to design a copper area distributed in all the layers for more effective heat dissipation.
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