STMicroelectronics RF Transceiver, 6-Pin Bumpless CSP
- RS-stocknr.:
- 192-3828
- Fabrikantnummer:
- MLPF-WB55-01E3
- Fabrikant:
- STMicroelectronics
Subtotaal (1 rol van 5000 eenheden)*
€ 835,00
(excl. BTW)
€ 1.010,00
(incl. BTW)
GRATIS bezorging voor bestellingen van meer dan € 75,00
Tijdelijk niet op voorraad
- Verzending vanaf 28 april 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Aantal stuks | Per stuk | Per rol* |
|---|---|---|
| 5000 + | € 0,167 | € 835,00 |
*prijsindicatie
- RS-stocknr.:
- 192-3828
- Fabrikantnummer:
- MLPF-WB55-01E3
- Fabrikant:
- STMicroelectronics
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | STMicroelectronics | |
| Technology | IPD on Non-Conductive Glass Substrate | |
| Product Type | RF Transceiver | |
| Sub Type | RF Transceiver | |
| Package Type | Bumpless CSP | |
| Pin Count | 6 | |
| Mount Type | Surface | |
| Operating Band 1 Frequency | 2500MHz | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 105°C | |
| Series | MLPF-WB55 | |
| Length | 1.63mm | |
| Standards/Approvals | ECOPACK2 | |
| Width | 1.6 mm | |
| Number of Operating Bands | 1 | |
| Automotive Standard | No | |
| Alles selecteren | ||
|---|---|---|
Merk STMicroelectronics | ||
Technology IPD on Non-Conductive Glass Substrate | ||
Product Type RF Transceiver | ||
Sub Type RF Transceiver | ||
Package Type Bumpless CSP | ||
Pin Count 6 | ||
Mount Type Surface | ||
Operating Band 1 Frequency 2500MHz | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 105°C | ||
Series MLPF-WB55 | ||
Length 1.63mm | ||
Standards/Approvals ECOPACK2 | ||
Width 1.6 mm | ||
Number of Operating Bands 1 | ||
Automotive Standard No | ||
- Land van herkomst:
- CN
The MLPF-WB55-01E3 integrates an impedance matching network and harmonics filter. The matching impedance network has been tailored to maximize the RF performance of STM32WB55xx. This device uses STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF performance.
Integrated impedance matching to STM32WB55Cx and STM32WB55Rx
LGA footprint compatible
50 Ω nominal impedance on antenna side
Deep rejection harmonics filter
Low insertion loss
Small footprint
Low thickness ≤ 450 μm
High RF performance
RF BOM and area reduction
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