Infineon 600 V 8 A Rectifier & Schottky Diode DPAK
- RS-stocknr.:
- 258-0955
- Fabrikantnummer:
- IDD08SG60CXTMA2
- Fabrikant:
- Infineon
Subtotaal (1 rol van 2500 eenheden)*
€ 3.455,00
(excl. BTW)
€ 4.180,00
(incl. BTW)
GRATIS bezorging voor bestellingen van meer dan € 75,00
Tijdelijk niet op voorraad
- Verzending vanaf 03 juni 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Aantal stuks | Per stuk | Per rol* |
|---|---|---|
| 2500 + | € 1,382 | € 3.455,00 |
*prijsindicatie
- RS-stocknr.:
- 258-0955
- Fabrikantnummer:
- IDD08SG60CXTMA2
- Fabrikant:
- Infineon
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Infineon | |
| Mount Type | Surface | |
| Product Type | Rectifier & Schottky Diode | |
| Package Type | TO-252 | |
| Maximum Continuous Forward Current If | 8A | |
| Peak Reverse Repetitive Voltage Vrrm | 600V | |
| Series | IDD08SG60C | |
| Maximum Forward Voltage Vf | 2.2V | |
| Peak Reverse Current Ir | 700μA | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | 175°C | |
| Standards/Approvals | JEDEC1) | |
| Automotive Standard | No | |
| Alles selecteren | ||
|---|---|---|
Merk Infineon | ||
Mount Type Surface | ||
Product Type Rectifier & Schottky Diode | ||
Package Type TO-252 | ||
Maximum Continuous Forward Current If 8A | ||
Peak Reverse Repetitive Voltage Vrrm 600V | ||
Series IDD08SG60C | ||
Maximum Forward Voltage Vf 2.2V | ||
Peak Reverse Current Ir 700μA | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature 175°C | ||
Standards/Approvals JEDEC1) | ||
Automotive Standard No | ||
The Infineon CoolSiC Schottky diodes 600V G3 feature the industry's lowest device capacitance for any given current rating, which further enhances overall system efficiency, especially at higher switching frequencies and under low load conditions. The generation 3 is based on the same technology platform as generation 2 with the introduction, at package level, of the so called diffusion soldering.
Benchmark switching behaviour
No reverse recovery charge
Reduced cooling requirements
Enabling higher frequency/increased power density
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