Wurth Elektronik WE-TGF Series Thermal Gap Pad, 5 mm Thick, 2 W/mK, 400 mm, 200mm, Ceramic Filled Silicone Rubber

This thermal gap pad provides a compliant Interface for transferring heat between uneven surfaces in electronic assemblies. It is a light blue, soft ceramic-filled silicone rubber material designed to bridge gaps and improve thermal contact in devices operating across a wide temperature range. The pad is supplied in a large sheet format to accommodate panel-level or custom-cut applications.

• 2W/mK thermal conductivity improves heat transfer efficiency
• 20 Shore C hardness allows conformal contact under low pressure
• Operational range -50 to 180°C preserves performance across temperatures
• Ceramic-filled silicone rubber maintains electrical isolation and the thermal path
• REACH and RoHS approvals support material regulatory acceptance

• Suitable for filling voids between heatsinks and components
• Ideal for thermal management in power electronics modules
• Used with enclosure panels requiring large gap coverage
• Can be used for prototype boards needing custom-cut pads

The product is supplied as a 200 x 400mm sheet allowing bespoke trimming for bespoke assemblies.

The light blue colour provides Visual contrast for placement verification during manual or automated assembly.

The pad exhibits a soft feel defined by 20 Shore C hardness, enabling it to compress and fill uneven interfaces.

The material conforms to REACH and RoHS (2011/65/EU & 2015/863) requirements, addressing regulated substance constraints.